Packaging Module Equipment Development Engineer

The world is transforming - and so is Intel. Intel is a company of bold and curious inventors and problem solvers who create some of the most astounding technology advancements and experiences in the world. With a legacy of relentless innovation and a commitment to bring smart, connected devices to every person on Earth, our diverse and brilliant teams are continually searching for tomorrow's technology and revel in the challenge that changing the world for the better brings. We work every single day to design and manufacture silicon products that empower people's digital lives. Come join us and do something wonderful.

• →Develop and optimize assembly processes and equipment to meet stringent quality, reliability, cost, yield, productivity, and manufacturability goals.
• →Apply Design of Experiments (DOE) principles and statistical methods to refine processes and specifications, equipment capabilities and gaps, and documenting findings through technical reports.
• →Ensure manufacturability of physical layouts in package designs, overseeing the lifecycle of manufacturing equipment health and long-term reliability from development through high volume manufacturing
• →Support integration of new materials and architectures into equipment for manufacturing success for advanced foundry customer product manufacturability
• →Innovate new techniques, tools, and quality screens to proactively identify and address equipment health and reliability issues.
• →Lead problem-solving initiatives and continuous improvement efforts for processes and equipment.
• →Standardize equipment qualification practices and manufacturing quality systems while addressing technical risks aligned with product milestones.

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You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience listed below would be obtained through a combination of your degree, research and or relevant previous job and or internship experiences.

• US Citizenship
• Bachelor's degree in Mechanical Engineering, Materials Science, Metallurgical Engineering, or a related STEM field with 2+ years of relevant experience OR Master's degree in Mechanical Engineering, Materials Science, Metallurgical Engineering, or a related STEM field with 1+ years of relevant experience OR PhD in Mechanical Engineering, Materials Science, Metallurgical Engineering, or a related STEM field.
• Proficiency in Statistical Process Control (SPC) and Design of Experiments (DOE) principles.

• Demonstrated ability to lead technical innovation and manage complex, time-sensitive projects.
• Experience with high-volume manufacturing including equipment troubleshooting and change qualification
• Understanding of semiconductor fabrication processes and packaging technologies.
• Familiarity with equipment install and qualification
• Experience with optimization of procedures or design for safety, quality and/or cost-effective manufacturability