Packaging Process Development Engineer

Intel Corporation is one of the world's leading semiconductor companies, driving innovation across computing, connectivity, and artificial intelligence. With a legacy of over 50 years of technological breakthroughs, Intel empowers billions of people globally through world-class products and solutions. Our teams are made up of bold thinkers, problem-solvers, and innovators who are passionate about shaping the future of technology. At Intel, we believe in creating an inclusive workplace where diverse perspectives fuel creativity and drive meaningful impact.

Intel's Packaging Module Development team is seeking a talented and driven Packaging Process Development Engineer to join our Arizona-based team. In this role, you will be at the forefront of advancing next-generation semiconductor packaging technologies, playing a critical part in Intel's product roadmap. You will develop and optimize innovative assembly processes and equipment, directly influencing the performance, reliability, and quality of Intel's cutting-edge products. This is a unique opportunity to make a lasting impact on the semiconductor industry while working alongside some of the brightest minds in the field.

• →Develop and optimize assembly media and collaterals to achieve quality, reliability, cost, yield, productivity, and manufacturability targets.
• →Apply Design of Experiments (DOE) and Statistical Process Control (SPC) principles to refine media and collateral capabilities, documenting findings through detailed technical reports.
• →Design and maintain equipment to evaluate media and collateral performance under simulated field conditions, including temperature cycles, heat, humidity, and dynamic mechanical forces.
• →Ensure manufacturability of physical prototypes and oversee the full lifecycle of manufacturing workflows.
• →Define material specifications and collaborate closely with supplier quality and procurement teams to maintain compliance with quality and performance benchmarks.
• →Leverage a deep understanding of failure mechanisms to establish reliability benchmarks aligned with customer requirements.
• →Lead problem-solving initiatives and champion continuous improvement efforts for media and collaterals.
• →Standardize manufacturing qualification practices and quality systems while managing technical risks in alignment with product milestones and supplier delivery schedules.
• →Serve as a subject matter expert, providing technical consultation to internal teams and external partners on media and collateral solutions.

• Collaborative mindset – You thrive in cross-functional team environments and build strong relationships with colleagues, suppliers, and partners.
• Analytical thinking – You approach complex problems with a structured, data-driven mindset and a passion for finding root causes.
• Effective communication – You can clearly articulate technical concepts to both technical and non-technical audiences, both verbally and in writing.
• Adaptability – You are comfortable navigating ambiguity and shifting priorities in a fast-paced, innovation-driven environment.
• Attention to detail – You take pride in precision and thoroughness, ensuring quality and accuracy in everything you do.
• Initiative & ownership – You proactively identify opportunities for improvement and take ownership of outcomes from start to finish.
• Resilience – You remain focused and solution-oriented when faced with challenges or setbacks.

Are you ready to make your mark on the future of semiconductor packaging? Join Intel's team of world-class innovators in Arizona and help redefine what's possible in next-generation packaging technologies. Apply today and take the next step in your engineering career at one of the most iconic technology companies in the world.

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience would be obtained through a combination of prior education level classes, and current level school classes, projects, research and relevant previous job and/or internship experience.

• Bachelor's degree in Mechanical Engineering, Materials Science, Metallurgical Engineering, or related STEM field with 2+ years of experience
• OR master's degree in mechanical engineering, Materials Science, Metallurgical Engineering, or related STEM field
• Relevant experience should be in the following:
  • Knowledge of mechanical design software such as SolidWorks or AutoCAD.
  • Mechanical drawings, Geometric Dimensioning and Tolerancing (GD&T) principles

• 2+ years of experience in:
  • Statistical Process Control (SPC) and Design of Experiments (DOE) methodologies.
  • Drive technical innovation and manage complex, time-sensitive projects.
  • High-precision manufacturing methods, including stamping and CNC machining.
  • Semiconductor fabrication processes and packaging technologies.
  • Supply chain management in a manufacturing or materials qualification environment.

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