19h ago
New

Packaging Research and Development Engineer

United StatesUnited States·Phoenixmid
OtherDevelopment Engineer
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Quick Summary

Key Responsibilities

- Define and establish equipment configurations, process specifications,

Requirements Summary

You must possess the below minimum qualifications to be initially considered for this position.

Technical Tools
OtherDevelopment Engineer

Substrate Packaging Technology Development (SPTD) is looking for a Packaging Research and Development Engineer to join the Module Engineering Backend Area specifically to be in charge of process and material development to scale advanced substrate packaging technology to enable further die disaggregation / heterogenous integration.

This position requires most of time spent on the factory floor and/or interacting with equipment/material suppliers. The candidate will join and become part of a world class first of a kind embedded die packaging facility, learn advanced substrate manufacturing know-how, drive disruptive technology innovations, and be part of creating history in the substrate packaging industry.

Responsibilities will include but not be limited to:

Requirements

~1 min read

Candidate must possess at least one for the following:

  • Bachelor’s degree in Mechanical Engineering, Chemical Engineering, Materials Science, Physics, Chemistry or related and 5+ years of experience.
  • Master’s degree in Mechanical Engineering, Chemical Engineering, Materials Science, Physics, Chemistry or related and 3+ years of experience.
  • PhD degree in Mechanical Engineering, Chemical Engineering, Materials Science, Physics, Chemistry or related and 1+ years of experience.

Experience listed above should be a combination of the following:

  • Semiconductor manufacturing experience
  • Semiconductor Technology development
  • Material Development

What We Offer

~1 min read
This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

*

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

Location & Eligibility

Where is the job
Phoenix, United States
On-site at the office
Who can apply
US

Listing Details

Posted
September 29, 2026
First seen
September 29, 2026
Last seen
September 29, 2026

Posting Health

Days active
0
Repost count
0
Trust Level
56%
Scored at
September 29, 2026

Signal breakdown

freshnesssource trustcontent trustemployer trust
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Packaging Research and Development Engineer