Packaging Research and Development Engineer
Quick Summary
- Define and establish equipment configurations, process specifications,
You must possess the below minimum qualifications to be initially considered for this position.
Substrate Packaging Technology Development (SPTD) is looking for a Packaging Research and Development Engineer to join the Module Engineering Backend Area specifically to be in charge of process and material development to scale advanced substrate packaging technology to enable further die disaggregation / heterogenous integration.
This position requires most of time spent on the factory floor and/or interacting with equipment/material suppliers. The candidate will join and become part of a world class first of a kind embedded die packaging facility, learn advanced substrate manufacturing know-how, drive disruptive technology innovations, and be part of creating history in the substrate packaging industry.
Responsibilities will include but not be limited to:
Requirements
~1 min readCandidate must possess at least one for the following:
- Bachelor’s degree in Mechanical Engineering, Chemical Engineering, Materials Science, Physics, Chemistry or related and 5+ years of experience.
- Master’s degree in Mechanical Engineering, Chemical Engineering, Materials Science, Physics, Chemistry or related and 3+ years of experience.
- PhD degree in Mechanical Engineering, Chemical Engineering, Materials Science, Physics, Chemistry or related and 1+ years of experience.
Experience listed above should be a combination of the following:
- Semiconductor manufacturing experience
- Semiconductor Technology development
- Material Development
What We Offer
~1 min read*
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.Location & Eligibility
Listing Details
- Posted
- September 29, 2026
- First seen
- September 29, 2026
- Last seen
- September 29, 2026
Posting Health
- Days active
- 0
- Repost count
- 0
- Trust Level
- 56%
- Scored at
- September 29, 2026
Signal breakdown
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