Quick Summary
You must possess the below minimum qualifications to be initially considered for this position.
We are part of the assembly and test technology development team based in Chandler, supporting advanced electronic packaging technology development. Our team directly supports quality and reliability failure analysis and also supports package material and assembly process development.
The candidate will be responsible for conducting failure analysis to identify electrical failures, as well as physical failure analysis to support root cause understanding of new package technologies. Require setting up, operating and maintaining laboratory instruments, conducting experiments, making observations and documenting results, and often developing conclusions.
Note: The work schedule will be 10x4 (10hr per day, Sunday – Wednesday or Wednesday – Saturday).
Requirements
~1 min read*
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.Location & Eligibility
Listing Details
- Posted
- October 13, 2026
- First seen
- October 13, 2026
- Last seen
- October 13, 2026
Posting Health
- Days active
- 0
- Repost count
- 0
- Trust Level
- 56%
- Scored at
- October 13, 2026
Signal breakdown
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