Sort Probe Card Module Engineer

Note: This role requires regular onsite presence to fulfill essential job responsibilities.

New Mexico is Intel's flagship high-volume Advanced Packaging manufacturing site, providing full co-location of the Advanced Packaging line at a single site, with New Mexico Die Sort (NM DS) serving as a key segment of the manufacturing operation.

As a Sort Probe Card Module Engineer within the NM DS Probe Card Metrology (PCM) team, you will play an essential role in ensuring the efficiency and reliability of high-volume manufacturing equipment and processes that support Intel's advanced semiconductor production.

You will be responsible for monitoring, maintaining, troubleshooting, and optimizing Sort Interface Unit (XIU) and metrology equipment to meet quality, safety, and operational goals while contributing to the development and implementation of innovative process solutions.

Your work will directly impact Intel's ability to deliver cutting-edge technologies at scale and support both current and future semiconductor manufacturing needs. This position offers an opportunity to contribute to Intel's foundry and Advanced Packaging success while driving innovation, process improvements, and operational excellence.

• →Own and optimize Sort Interface Unit (XIU) and metrology equipment performance, including advanced troubleshooting, preventive maintenance and repair improvements, process monitoring, data analysis, and excursion response.
• →Drive PCM-related improvements in safety, quality, equipment availability, yield, cost, standardization, process control, and manufacturability.
• →Develop, implement, and optimize XIU metrology recipes for new product introductions (NPIs) and existing production processes.
• →Partner with Technology Development (TD) teams to transfer and optimize new processes and probe technologies.
• →Explore and develop improved XIU repair and measurement methodologies to support new and emerging probe technologies.
• →Perform root-cause analysis and implement corrective actions for integrated processing issues in collaboration with other modules, upstream and downstream partners, and cross-functional engineering teams.
• →Collaborate with Virtual Factory (VF) partners to drive and implement global process and operational improvements.
• →Provide training, mentoring, and coaching to technicians while maintaining a customer-oriented approach to manufacturing support and promoting innovation and collaboration.
• →Oversee the installation, qualification, and maintenance of new and existing equipment during factory ramps.
• →Develop and maintain strong partnerships with internal teams and external probe card and metrology equipment vendors and developers.

• Demonstrated experience with statistical process control methodologies and engineering analysis tools.
• Proficiency in model-based problem-solving and root-cause analysis methodologies, including MBPS, DOE, FMEA, or equivalent approaches.
• Strong verbal and written communication skills, with the ability to influence peers and managers and communicate complex technical information clearly and concisely.
• Demonstrated disciplined execution, sound judgment, and the ability to act with an appropriate level of urgency.
• Results-oriented, organized, resourceful, and self-directed, with the ability to demonstrate initiative and work independently.
• Strong attention to quality and detail, with the ability to maintain high standards in manufacturing operations.
• Ability to adapt to new and frequently changing challenges in a high-volume manufacturing environment.
• Ability to manage multiple priorities across process engineering, equipment sustaining, continuous improvement, process transfer, and Virtual Factory activities.
• Ability to work effectively within and across organizations, including leading and participating in cross-functional team efforts.
• Demonstrated ability to develop, qualify, and implement process and/or hardware improvements.
• Ability to successfully plan, develop, and execute projects lasting two or more months.

Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications

Candidates must possess one of the following:

• Bachelor's degree in Electrical, Mechanical, or Chemical Engineering, Materials Science, or a related technical discipline with 3+ years of semiconductor device fabrication or semiconductor manufacturing experience; OR
• Master's degree in Electrical, Mechanical, or Chemical Engineering, Materials Science, or a related technical discipline with 2+ years of semiconductor device fabrication or semiconductor manufacturing experience; OR
• PhD in Electrical, Mechanical, or Chemical Engineering, Materials Science, or a related technical discipline with 2+ years of semiconductor device fabrication or semiconductor manufacturing experience.
  

• Data fluency, including data extraction, visualization, statistical analysis, and interpretation for decision-making.
• Experience supporting and leading cross-functional task forces as a facilitator or technical lead.
• Previous PCM or other Sort/Test experience.
• Experience working in high-volume manufacturing or technology development environments.
• Strong collaboration and communication skills with cross-functional teams and external suppliers

Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.

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