24d ago

Substrate Supplier Enablement Engineer

United States·Phoenixmid

OtherEngineer

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Quick Summary

Requirements Summary

This role requires periodic meetings with suppliers in East Asia and stakeholder in US, as well as occasional trip to supplier

Technical Tools

OtherEngineer

The Advanced Packaging Technology Development (APTD) Substrate and Wafer Assembly organization is responsible for developing cutting edge substrate packaging and wafer assembly solutions for our customers. As a member of the Substrate Technology Integration Group, you will play a critical role in enabling new manufacturing capacity across advanced packaging suppliers.

In this position, you will lead substrate supplier development and qualification activities for advanced technologies such as high density FCBGA, EMIB-T and glass core substrate, ensuring suppliers achieve the required readiness to support growing customer demand. This includes driving technical enablement, managing readiness milestones, and collaborating closely with cross functional engineering teams and supplier partners.

Please note: This role requires periodic meetings with suppliers in East Asia and stakeholder in US, as well as occasional trip to supplier sites to support essential program objectives.

Responsibilities

Requirements

~1 min read

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.