14d ago

Thermal Analysis Engineer

OtherEngineer

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Quick Summary

Key Responsibilities

Conduct research leveraging device physics, thermomechanical analysis, materials science, and process innovations to enable novel devices and systems.

Requirements Summary

Minimum Qualifications: Minimum qualifications are required to be initially considered for this position. Bachelor's or BS degree in Electrical Engineering, Physics, Materials Science,

Technical Tools

OtherEngineer

As a Semiconductor Research Engineer, you will drive scientific innovation and research that shapes the future of semiconductor technologies. This role focuses on designing, simulating, and developing novel devices, packages, and interconnects using device physics, electromagnetics, and advanced materials science. You'll lead hands-on experiments to build prototypes that demonstrate groundbreaking concepts and collaborate across teams to establish methodologies that optimize performance, reliability, and cost. Your contributions will directly impact Intel's advancements in assembly packaging platform technologies, ensuring the company remains at the forefront of the industry.

Business Group Join Intel Corporation's Thermal Core Comp organization, a team dedicated to enabling next-generation semiconductor technologies. This group leverages cutting-edge research and development efforts to ensure Intel delivers innovative assembly and packaging solutions that advance device miniaturization, high-speed signaling, and thermomechanical capabilities. As part of this team, you'll contribute to Intel's mission of transforming technology landscapes and driving industry progress.

Responsibilities

~1 min read

→Conduct research leveraging device physics, thermomechanical analysis, materials science, and process innovations to enable novel devices and systems.
→Design and fabricate prototypes to demonstrate proof-of-concepts for groundbreaking packaging and interconnect technologies.
→Perform electrical testing and establish methodologies for device characterization, including DC, RF signal analysis, pulsing, and stressing.
→Develop process solutions across production modules, such as lithography, etch, diffusion, CVD, PVD, and CMP, to address technological challenges.
→Plan and execute experiments in collaboration with device, reliability, and fabrication teams to benchmark results against industry standards.
→Develop models and measurements to advance the understanding of device physics, packaging, and systems for future technology platforms.
→Engage with external vendors and researchers to support collaborations and Intel's research pipeline.

Requirements

~1 min read

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.