Senior SMT PCBA Manufacturing / Process Engineer

The Senior SMT PCBA Manufacturing / Process Engineer is responsible for developing, optimizing, and sustaining Surface Mount Technology (SMT) and Printed Circuit Board Assembly (PCBA) manufacturing processes to achieve world-class performance in quality, cost, delivery, and productivity. The role provides technical leadership for NPI, process validation, yield improvement, equipment qualification, automation initiatives, and continuous improvement projects while supporting high-volume production and customer requirements.

• Own SMT and PCBA manufacturing processes from stencil printing through reflow, AOI, SPI, selective soldering, wave soldering, depanelization, coating, and final assembly.
• Develop and maintain process flows, control plans, PFMEA, work instructions, and process specifications.
• Lead process troubleshooting and root cause investigations for manufacturing issues.
• Drive yield, throughput, and cycle-time improvement initiatives.
• Establish process controls to ensure stable and repeatable production performance.
• Monitor process capability (Cp/Cpk) and implement corrective actions when required.

• Lead DFM and DFA reviews during product development.
• Support manufacturing readiness activities for new product introduction.
• Define manufacturing process requirements, tooling, fixtures, and equipment.
• Lead pilot builds, engineering builds, and production ramp-up activities.
• Develop manufacturing documentation and train production personnel.
• Manage product transfer activities between sites or customers.

• Optimize the following process areas:

• Solder paste printing
• Placement processes
• Reflow profiles
• AOI inspection programs
• SPI inspection strategies
• Selective soldering parameters
• Wave soldering parameters

• Establish process windows and operating limits.
• Improve first-pass yield and reduce defect opportunities.
• Analyze defect trends and implement sustainable corrective actions.

• Lead equipment selection, qualification, installation, and commissioning.
• Support SMT printers, pick-and-place machines, reflow ovens, SPI systems, AOI systems, X-Ray systems, and selective soldering equipment.
• Develop and implement automation solutions to improve productivity.
• Support Industry 4.0 manufacturing initiatives and digitalization programs.

• Lead IQ, OQ, PQ, Process Validation, and Test Method Validation activities.
• Perform Gauge R&R, MSA, SPC, and process capability studies.
• Review and update PFMEA, Control Plans, and Risk Assessments.
• Support customer, ISO, and regulatory audits.
• Ensure compliance with IPC standards and customer requirements.

• Lead Lean Manufacturing initiatives.
• Facilitate DMAIC projects, Kaizen events, Value Stream Mapping, and OEE improvement projects.
• Drive cost reduction through yield improvement, labor optimization, material savings, automation, and cycle-time reduction.
• Establish KPI dashboards and performance monitoring systems.

• Mentor Process Engineers and Manufacturing Engineers.
• Provide technical coaching to technicians and production teams.
• Lead cross-functional problem-solving activities.
• Interface directly with customers regarding technical challenges and improvement initiatives.
• Lead engineering reviews and manufacturing readiness assessments.

Strong technical knowledge of:

• SMT process development
• Stencil design and solder paste technology
• Pick-and-place programming
• Reflow profiling and optimization
• AOI and SPI systems
• X-Ray inspection techniques
• Wave soldering
• Selective soldering
• PCB defect analysis
• Conformal coating processes
• PCBA assembly technologies

Proficiency in:

• SPC and Minitab
• DMAIC and Lean Six Sigma
• PFMEA, Process Flow Diagrams, and Control Plans
• 8D Methodology, Fishbone Analysis, and 5 Why Analysis
• Time Study and Capacity Analysis
• AutoCAD (preferred)
• MES and manufacturing systems

Strong understanding of:

• IPC-A-610
• IPC J-STD-001
• IPC-7711/7721
• ISO 9001
• ISO 13485 (preferred)
• FDA 21 CFR Part 820 (preferred)
• ESD control programs
• Change control systems
• CAPA processes

• Bachelor's Degree in Electronics, Electrical, Manufacturing, Mechanical, Industrial Engineering, or a related engineering discipline.

• 8+ years of SMT/PCBA manufacturing engineering experience.
• Minimum 5 years supporting high-volume SMT production.
• Experience with NPI, process validation, and yield improvement.

• 10+ years in electronics manufacturing services (EMS).
• Experience in a major EMS or equivalent high-mix electronics manufacturing environment.
• Lean Six Sigma Green Belt or Black Belt certification.
• Experience leading manufacturing transfer projects and multi-site deployments.

• First Pass Yield (FPY)
• Defect Rate (DPMO/PPM)
• OEE Improvement
• SMT Placement Efficiency
• Reflow Yield
• Cost Reduction Achievement
• Cycle Time Reduction
• NPI Ramp Success
• Corrective Action Closure
• Customer Quality Performance
• Equipment Utilization

Jabil, including its subsidiaries, is an equal opportunity employer and considers qualified applicants for employment without regard to race, color, religion, national origin, sex, sexual orientation, gender identity, age, disability, genetic information, veteran status, or any other characteristic protected by law.