Principal Member of Technical Staff, LCM Advanced Packaging & Manufacturing Engineer

Lumotive is pioneering the era of programmable optics—where light is controlled as intelligently and flexibly as software.

 

At the heart of this transformation is a once-in-a-generation innovation: a flat CMOS-based “general purpose optic.” Lumotive’s Light Control Metasurface (LCM™) beam forming chips can be programmed to function as a beam steering mirror, a lens, mirror, a beam splitter—or any optical function—replacing bulky and mechanical optical components with a fully digital, reconfigurable semiconductor . This breakthrough lays the foundation for a massive shift in multiple technologies—from 3D sensing and imaging to optical networking, free space optical communication, and beyond. Like the shift from analog to digital in electronics, programmable optics will reshape industries from robotics, self-driving cars, AI, defense, and healthcare.

Lumotive’s first commercial application is in LiDAR, where its software-defined beam steering chips are already enabling compact, high-performance, solid-state sensors. These sensors are being deployed today in smart infrastructure, robotics, and mobility systems through leading module makers and solution integrators.

With more than 200 patents and growing commercial traction, Lumotive is delivering the world’s first digital platform for light—and redefining what’s possible in the optical age.

Lumotive is seeking a Principal Member of Technical Staff based in Taiwan with deep expertise in New Product Introduction (NPI)  and production management for semiconductor advanced packaging and test of optical devices. This is an outward-facing role that requires regular travel to key suppliers across Taiwan and China.

You will serve as a critical link between design and production, executing best practices with vendors across wafer fab, OSAT, LCOS assembly, optical sub-assembly, and test, including support for Lumotive’s wafer fab partner as needed. In addition to technical leadership, this role requires strong project ownership, supplier coordination, and disciplined execution to drive schedules, milestones, and issue resolution across a distributed supply base.  The role reports to the Director, Semiconductor Module Manufacturing in the Redmond, Washington office.

 

• Bachelor’s degree in Mechanical Engineering, Manufacturing Engineering, Materials Science, or a related field (MS/PhD or equivalent practical experience strongly preferred)
• 12+ years of industry experience, including 10+ years in supplier-facing manufacturing, process, quality, or NPI engineering roles
• Fluency in Mandarin and English is required
• Proven experience in DFM and process design for opto-mechanical and opto-electronic systems
• Strong background in semiconductor packaging, LCOS, or MEMS assembly, with a focus on optical subsystems
• Experience working with semiconductor and advanced packaging suppliers in Taiwan
• Demonstrated ability to manage complex project schedules and drive supplier execution
• Experience with wafer bonding, dicing, AOI, wire bonding, optical alignment, and related assembly processes
• Skilled in drawing review, process documentation, technical data packages, and production audits
• Experience leading supplier qualification, process readiness reviews, and production ramp activities
• Ability to drive technical issue resolution across design, test, quality, and operations teams
• Experience  with PLM, MES, and SPC systems for managing production data and supplier quality is required
• Experience with tools such as Arena (PLM), SolidWorks, Tableau, and JMP