Packaging and Assembly lead

Lyte builds perception systems for Physical AI operating in complex environments. The company combines custom silicon, integrated sensors, and software into a unified platform for robotics, mobility, and next-generation automation. Lyte is headquartered in Sunnyvale, California, with a global presence. For more information, visit www.lyte.ai

• We are seeking an experienced process lead/Manager in the field of optical sensor device packaging and contract manufacture with a degree in Electrical Engineering, Photonics, Mechanical Engineering, Physics or a related field.Describe the role and team the candidate will be joining

• →Lead NPI process team involving wafer, device packaging, PCBA assembly process improvement and optimization for yield improvement through material selection optimization, process refinement, or specs opening through DOE for corner case studies.
• →Communicate with the RnD team to understand the design targets, existing specs, and existing process flow, process maturity, and its related yield for each process step.
• →Lead the tradeoff between the design and process.
• →Work with our wafer foundries and OSATs to support NPI and volume production contract manufacture.
• →Lead process integration check to ensure the upstream process will not affect the downstream process yield.
• →Act as the technical program manager for operation process team.
• →Provide DFM, DFR, DFT inputs for HQ RnD teams for device tapeout design ad device packaging during the design phase.
• →Develop and maintain packaging and component specifications as well as inventory tracking.
• →Audit/regularly visit our contract Manufacturers and suppliers then provide reports.
• →Write technical reports and present results to internal and external stakeholders.
• →Build and grow the Operation Process Team worldwide.
• →Write technical SOW.
• →Drive Cp, Cpk, and yield improvement.

• Minimal requirement is a Master or Ph.D. degree with 8 years of relevant experience.
• Experience with process integration for process flow design and continue process improvement.
• Former experience of microelectronic and optical devices packaging is a must.
• Project management capability/experience is a must.
• Experience working with foundries, OSATs, PCBA fab, and contract manufacturers in process development and yield improvement is important.
• Experience with FMEA, failure analysis, and 8D report.
• Ability to work independently and take ownership of projects as well as collaboratively in cross-functional teams is a must.
• Fast learner is a must.
• Good work ethics is a must
• Capable of keeping company confidential information and IP is a must.

• Experience on process flow design, and SPC, particularly the six sigma and Lean manufacture continuing improvement plan, and material staging concept are highly desirable.
• Familiar with data analysis software such as JMPs is a plus.
• Knowledge of wafer level process including lithography, thin film, plating, and DIE/DRIE is a plus.
• Experience with PCBA process is highly desirable.
• Understanding Silicon Photonics is a plus.
• Experience in IIIV wafer process, bar level process, and CoC packaging is a plus.
• Supplier quality management experience is a plus.
• Knowledge of Lidar and relevant technologies is a plus.
• Former experience of writing technical SoW is a plus.
• Familiar with ECN, PCN and documentation are highly desirable.