lyte
lyte~2h ago
New

Packaging Design and SI/PI Engineer

OtherEngineer
0 views0 saves0 applied

Quick Summary

Requirements Summary

Siwave, HFSS, APD, or similar Maintain company confidential information are a must Preferred Qualifications Master’s degree with more experience is highly

Technical Tools
OtherEngineer
  • About Lyte

Lyte builds perception systems for Physical AI operating in complex environments. The company combines custom silicon, integrated sensors, and software into a unified platform for robotics, mobility, and next-generation automation. Lyte is headquartered in Sunnyvale, California, with a global presence. For more information, visit www.lyte.ai

About the Role

~1 min read
  • We are seeking a middle to senior level packaging design and signal/power integrity Engineer with degree in Electrical Engineering, or a related field.

Responsibilities

~1 min read
  • →Own the design and layout of our micro-electronic package, the heart of our LyteCore system
  • →Collaborate with multi-disciplinary team of engineers (silicon, photonics, system, operations) to define physical and electrical performance specifications for the package
  • →Perform signal/power integrity simulation to optimize our package & system performance
  • →Work with our substrate/package vendors to ensure design for manufacturability and support delivery of our design on time. Work with said vendors to define high volume price target.
  • →Project tracking weekly.
  • →Write technical reports and present results.
  • →Maintain EDA tools and actively project future needs, including improving design flow definition and recommending EDA envelope.

Requirements

~1 min read
  • Minimal requirement is a bachelor's degree with 5 years of experience
  • Fluent in English communication, able to collaborate with teammates in different time zones
  • Experience in substrate design and packaging technology
  • Experience in signal and power integration simulation and interpretation of the results
  • Experience in EDA tools: Siwave, HFSS, APD, or similar
  • Maintain company confidential information are a must 
  • Master’s degree with more experience is highly desired
  • Proactive member of the multi-disciplinary team, takes ownership of technical challenges and work with others to resolve issues
  • Experience with hands-on testing of electronic packages/systems.
  • Knowledge and experience in at least some following processes: device packaging processes such as die attach, flip chip, wire bonding, and module mechanical assembly processes, particularly camera and lidar module assembly. 
  • Experience in other EDA tools such as Altium, Allegro PCB, Spectre, Hspice, Sigrity, ADS.
  • Data analysis experience such as JMPs is a plus; excel is OK.
  • Programming and software maintenance skills are desired eg. python, or C++
  • Describe the experience and attributes of the ideal candidate

Benefits (subject to location and local regulations)

  • Competitive salary and equity 
  • Flexible vacation and time-off policy 
  • Collaborative, fast-paced, and inclusive work environment 
  • Opportunity to work on cutting-edge technologies with a highly cross-functional team 

Location & Eligibility

Where is the job
Singapore
On-site within the country
Who can apply
SG

Listing Details

First seen
September 26, 2026
Last seen
September 26, 2026

Posting Health

Days active
0
Repost count
0
Trust Level
52%
Scored at
September 26, 2026

Signal breakdown

freshnesssource trustcontent trustemployer trust
Newsletter

Stay ahead of the market

Get the latest job openings, salary trends, and hiring insights delivered to your inbox every week.

A
B
C
D
Join 12,000+ marketers

No spam. Unsubscribe at any time.

lytePackaging Design and SI/PI Engineer