PDK Management DTCO Engineer - TPG

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

At Micron Technology, Inc., we are looking for a highly motivated and dedicated engineer with a strong focus on DTCO (Design Technology Co-Optimization) to join our team in Richardson, Texas! This position offers a chance to work on advanced technologies and make valuable contributions to the development of world-class memory and storage solutions!

Responsibilities:

• In this role you will be responsible for PDK change management. This is a cross-functional role that involves close collaboration with product design teams, process integration, design rules, modeling and CAD.
• Develop and run process for PDK verification and benchmarking; actively drive to resolution any issues found, involving all the necessary stakeholders.
• Planning and scheduling PDK releases and development times.
• Handle and disposition ongoing cross-functional PDK change requests

Qualifications & Skills:

• Proven experience and a solid understanding of semiconductor technology, semiconductor device physics, compact modeling, design rules, and CAD and CAD tools
• You are a self-motivated individual with excellent teamwork skills, thriving in a collaborative environment.
• You possess excellent analytical, analysis, and problem-solving skills.
• You are adaptable to a fast-paced, constantly evolving environment with wide-ranging demands.
• Strong communication and collaboration skills, with the ability to effectively convey complex technical concepts in verbal and written form.
• Tools: Star RC, FineSim, Calibre; programming skills - Python, Bash
• Proficiency with using AI in your daily work

Education and Experience:

• B.S., M.S., or "PhD or equivalent experience" in Electrical Engineering or a relevant field
• At least 5 years of work experience in the semiconductor industry, preferably in a Design-Technology Co-Optimization role.

Micron Technology, a leader in the field of semiconductor manufacturing since 1978, has achieved outstanding progress in memory technology.  

• World Leader in DRAM
• Pioneer in HBM: The HBM3e product is a market leader, offering 30% less power consumption and superior performance compared to competitors. 
• Patent Portfolio: Over 54,000 registered patents, with a leading engineer surpassing Thomas Edison’s patent count. 
• R&D Investment: Annual U.S. R&D investment ranging from $2.8 to $3.5 billion. 
• CHIPS & Science Act Funding: Received $8.1 billion in funding. 
• Future Investments: Committed to investing $150 billion in the U.S. over the next decade. 
• Global Expansion: New facilities in Japan, Malaysia, India, and Mexico. 
• U.S. Manufacturing Expansion: Two new fabs in Boise, ID, and Clay, NY, focusing on DRAM and HBM production, with Boise’s facility set to be the largest clean room space in the U.S.