Senior NAND Applications Engineer
senior
OtherApplications Engineer
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Requirements Summary
* Technical support to enable product acceptance and use from Sample through Qualification * Customer and Factory support for Application Qualification through communication of technical needs,
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OtherApplications Engineer
Req. ID:
JR113372 Senior NAND Applications Engineer
Our vision is to transform how the world uses information to enrich life for all.
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
# The NAND Component Applications Engineer team is looking for outgoing technical candidates to join our team. Senior NAND Applications Engineers develop and define next generation NAND features and specifications for customers both internal and external. Our team also works with an array of external NAND component customers to train and enable them with the technical details necessary to utilize Micron’s NAND Flash memory.
# Responsibilities and Duties include, but not limited to:
Technical Feature and Specifications:
* Close collaboration with Design and other Development Engineering teams
* Development of specifications and technical features for inclusion in Design Data Sheets, Advance/Production Data Sheets, Specification Addendums, Application Notes, Tech Notes, and Technical Collateral for customer training and enablement
Product Enablement and Customer Qualification:
* Technical support to enable product acceptance and use from Sample through Qualification
* Customer and Factory support for Application Qualification through communication of technical needs, issues identification and problem resolution
* Customer training of advanced error correction features and other advanced features
* Provide feature and specification guidance to internal SSD development teams
Creation of datasheet specifications related to our next generation NAND interface
* Creation of datasheet specifications related to our next generation NAND features
* Engagement with internal development teams to define and enable usage of our next generation NAND interface features and buffer chip solutions
* Engagement with external controller partners and customers to enable usage of our next generation NAND products and buffer chip solutions
Performance modeling and performance benchmark definition and measurement
Technical Failure Analysis Support at Factory and in the Field including but not limited to:
* Field Application Engineering technical support for customer problem resolution
* Direct Customer technical support for product use and enablement as well as problem resolution and follow up with factory or customer corrective action
* Guide application-oriented problem resolution with factory received RMA (assist QA)
Training:
* New Product and Feature Definition
* Training of the Worldwide Field Applications Engineers on the latest design features and their utilization
* Customer product feature use training to enable design wins and product acceptance of Micron NAND
* New Product and Feature Definition to differentiate Micron’s NAND products from the competition
Coordination with Design Engineering, Product Engineering, Architectural Engineering as well as Marketing to develop products and features to align with Marketing targets and target Markets by providing customer feedback, competitive information and feature solutions that fit within product capabilities.
# Qualifications and Skills include, but not limited to:
* Bachelor or Masters Degree in Electrical Engineering, Computer engineering or equivalent
* 5-10 years experience working with NAND Flash/semiconductor memories
* A solid background in high-speed I/O interface design or characterization (e.g., DDR3, DDR4, DDR5, LPDDR4, LPDDR5 or ONFI) strongly preferred
* Excellent problem solving and analytical skills
* Effective communication skills in written and spoken English
* Good multitasking and organizational skills
* Strong presentation skills, self-motivation and enthusiastic
* Experience using AI technologies to improve engineering productivity, workflow efficiency, and decision-making.
* Demonstrated ability in applying AI solutions to solve complex technical and business challenges.
* Proven track record of leveraging AI and automation tools to accelerate analysis, content generation, and process optimization.
Job Profile(s):
Applications Engineer 3
Relocation level: (TBD)
Before Getting Started
Please review Micron’s Internal Job Application Policy on your regional PeopleNow Career Opportunities page before searching and applying for jobs. Note in particular that:
* Hiring managers may view your performance appraisals, original resume, transcripts or other performance-related documentation in your personal file. This information will be held in confidence.
* If you are selected to interview for a position, you must notify your direct supervisor before participating in the interview process.
As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on Benefits | Micron Technology, Inc
Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.
Location & Eligibility
Where is the job
—
Location terms not specified
Who can apply
Open to applicants worldwide
Listing Details
- Posted
- October 8, 2026
- First seen
- October 8, 2026
- Last seen
- October 8, 2026
Posting Health
- Days active
- 0
- Repost count
- 0
- Trust Level
- 56%
- Scored at
- October 8, 2026
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