Engineer II (Phicom/Wirebond)

Malaysia·Serembanmid

OtherEngineer

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Quick Summary

Key Responsibilities

Troubleshoot and resolve Wire Bond equipment issues to minimize downtime. Drive equipment reliability and preventive maintenance improvements. Support equipment

Requirements Summary

Education & Experience Must Have Bachelor's Degree in Electrical, Electronics, Mechanical, Mechatronics, Manufacturing Engineering, or equivalent. Minimum 2-5 years of semiconductor manufacturing

Technical Tools

OtherEngineer

Responsibilities

~1 min read

→Troubleshoot and resolve Wire Bond equipment issues to minimize downtime.
→Drive equipment reliability and preventive maintenance improvements.
→Support equipment qualification, validation, installation, and production ramp activities.
→Analyze OEE, yield, and downtime data to identify improvement opportunities.
→Lead equipment optimization, productivity, and cost reduction projects.
→Ensure compliance with safety, quality, and manufacturing standards.

Requirements

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Nice to Have

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What We Offer

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As an equal-opportunity employer, Nexperia values diversity not just because it is the right thing to do but because diverse teams perform better. We are dedicated to being inclusive, and a proof point of this dedication is that we were the main partner of the very first Dutch Paralympic Team NL House during the Paris 2024 Paralympic Games. Our recruitment process is inclusive and accessible to all, and we consider all applicants fairly, as well as providing a safe work environment and reasonable adjustments where requested.

In addition, we offer our colleagues the possibility to join employee resource groups such as the Pride Network Group or global and local Women's groups. Nexperia is committed to increasing women in management positions to 30% by 2030.