Senior Package Modeling Engineer

United States·Santa Clarasenior

Other

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Quick Summary

Key Responsibilities

Conduct Finite Element Analysis (FEA) to assess stress, warpage, and thermo-mechanical behavior throughout advanced semiconductor packaging platforms.

Requirements Summary

MS or PhD or equivalent experience in Mechanical Engineering, Materials Science, or related field. 5+ years of FEA modeling/simulation experience. Strong expertise in FEA tools (ANSYS, Abaqus,

Technical Tools

Other

Join us in an outstanding opportunity as a Senior Package Modeling Engineer in the Advanced Technology Group (ATG) at NVIDIA. Using our history of innovation, you will contribute to the next era of computing, driven by AI and pioneering technology. As part of our team, your efforts will directly affect the reliability and performance of advanced semiconductor package developments. This role is ideal for someone who is highly motivated and committed to achieving flawless results in a cooperative environment.

Responsibilities

~1 min read

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Conduct Finite Element Analysis (FEA) to assess stress, warpage, and thermo-mechanical behavior throughout advanced semiconductor packaging platforms.
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Contribute to packaging technology direction and long‑term roadmaps by evaluating new materials, interconnect concepts, and process options with a focus on structural robustness and reliability.
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Analyze material properties and their impact on package reliability.
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Establish modeling approaches and assumptions, interpret simulation results, and provide practical mentorship that influences package build, material selection, and manufacturing processes.
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Collaborate with cross-functional teams to ensure robust package builds.
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Document modeling methodologies and present findings to collaborators.

Requirements

~2 min read

MS or PhD or equivalent experience in Mechanical Engineering, Materials Science, or related field.
5+ years of FEA modeling/simulation experience.
Strong expertise in FEA tools (ANSYS, Abaqus, COMSOL, or equivalent).
Knowledge of thermal-mechanical interactions and reliability failure modes.
Familiarity with JEDEC reliability standards and accelerated life testing.
Practical understanding of advanced semiconductor packaging architecture and materials (flip-chip, 2.5D/3D IC, CoWoS-R, CoWoS-L, advanced substrates).
Excellent problem-solving, analytical, and communication skills.

This role offers an outstanding chance to work alongside world-class talent in an encouraging and ambitious environment. Your contributions will help determine the future of semiconductor packaging and enable NVIDIA to continue competing at the highest levels. Do what’s never been done before and make a lasting impact on the world!

#LI-Hybrid

Your base salary will be determined based on your location, experience, and the pay of employees in similar positions. The base salary range is 124,000 USD - 195,500 USD for Level 3, and 140,000 USD - 224,250 USD for Level 4.

You will also be eligible for equity and benefits.

Applications for this job will be accepted at least until September 14, 2026.

This posting is for an existing vacancy.

NVIDIA uses AI tools in its recruiting processes.

NVIDIA is committed to fostering an inclusive work environment and proud to be an equal opportunity employer. As we highly value diversity in our current and future employees, we do not discriminate (including in our hiring and promotion practices) on the basis of race, religion, color, national origin, gender, gender expression, sexual orientation, age, marital status, veteran status, disability status or any other characteristic protected by law.