Chip Lead

• AI & Chip Engineering team defines and develops System on Chip, ASIC’s, Digital and Analog IP’s for a wide range of products, including Automotive microprocessors, Application processors, Data Center and network processors. 

• Lead product execution for Automotive ASIL-B/D SoC’s & Data Center SOCs

• Work with Systems, Marketing, PE/TE and Arch engineering to define the part. Generate and analyze data to take right and cost effective architecture decision 

• Work with IP, Technology, packaging partners to assess the right IP/packages and technology options for the part. 

• Work with IP and SoC functions (frontend, verification, AMS, DFT, Emulation, Validation, Physical implementation) to understand and resolve inter/intra functional handoff and challenges. 

• Oversee definition management and make sure the implementation complies with the requirements 

• Work closely with downstream teams dependent on SOC, who are working on post-silicon activities, to make sure their needs are addressed 

• Work closely with Test and Product engineering teams to enable productization. 

• Work closely with post silicon evaluation teams (functional and analog Validation, Characterization, Application and Software teams) and address design issues. 

• Work with Program management office for management attention and clearly articulate dependencies and help needed for timely execution of projects. 

• Assess workload and resource demands based on complexity and create predictable project plans meeting customer requirements 

• Mentor engineers across various functions 

• Automotive SoC development pose additional challenges specific to implementation of safety mechanism 

• Automotive SoC development requires ensuring very high quality and reliability, ensuring a very low ppm defectivity over an long product life time. 

• The role includes leading the teams in a matrix organization, assimilating information from across functional teams and analyzing it in product context 

• Understand impact of architecture on logical and physical realizability 

• Working within resource and schedule constraints 

• This role is primarily about leading cross functional teams 

• During part definition is includes a close interaction with Business, Systems, Architects, third party IP vendors 

• During execution a close interaction and decision making is required between Technology, packaging, IP, Architecture, Various implementation functions, Test and Product Engineering. 

• Post silicon, close collaboration is needed with Software, Test and production engineering, Application and Field teams. 

• Overall, Chip lead is central design point of contact for all cross functional teams associated with the part. 

• Bachelors in Engineering with at 15 years of design development experience, with at least 5 years of leading complete design and design functions.  

• MS in Electrical Engineering preferred (higher level education may substitute for some experience). 

• Experience in leading Global cross functional teams 

• Experience in leading designs in smaller geometries desired 

• The role is based in Austin/US. This is a hybrid role with a few days in the office each week and the remaining days are work from home.

More information about NXP in the United States...

NXP is an Equal Opportunity/Affirmative Action Employer regardless of age, color, national origin, race, religion, creed, gender, sex, sexual orientation, gender identity and/or expression, marital status, status as a disabled veteran and/or veteran of the Vietnam Era or any other characteristic protected by federal, state or local law. In addition, NXP will provide reasonable accommodations for otherwise qualified disabled individuals.