~27m ago
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External Package Innovation Engineer

MalaysiaMalaysia·Kuala Lumpurmid
Other
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Quick Summary

Key Responsibilities

External site sourcing strategy Site selection process (jointly with interface manager) Lead project governance, inc

Technical Tools
Other

Hiring: External Package Innovation Engineer

We are looking for a highly motivated engineer to drive external package innovation initiatives and collaborate closely with OSAT partners for successful project execution.

🔹 Role Overview

As an EPI engineer, you will act as both a Role Owner and Key Supporter for OSAT-related development activities, ensuring robust execution from concept through production.

🔹 Key Responsibilities

✅ 1. Role Owner (Strategic & Governance)

  • Own and lead OSAT-wide and cross-OSAT initiatives
  • Define and deploy standard development templates and success criteria across OSATs
  • Drive deployment of Best Known Methods (BKM) and lessons learned
  • Develop and maintain technology roadmap and capability assessment for each OSAT site
  • Provide Package Innovation (PI) input for:
    • External site sourcing strategy
    • Site selection process (jointly with interface manager)
  • Lead project governance, including:
    • Overall project summaries
    • Stoplight reporting
    • Regular reviews per OSAT site

✅ 2. Supporter (Execution & Project Delivery)

  • Support NPI & NTI projects executed at external OSAT factories
  • Ensure OSAT compliance with:
    • Development processes
    • Required documentation/templates
  • Drive alignment on SME (Subject Matter Expert) assignment at OSAT
  • Support and resolve technical and project issues on-site and across time zones
  • Ensure assembly readiness and safe production launch

🔹 Stakeholder Collaboration

You will work closely with cross-functional teams, including:

  • Project Leaders & Development Managers
  • Designers & Materials Engineers
  • Tech Integration & Modelling teams (Electrical, Mechanical, Thermal)
  • API and WLP/PLP/FC SMEs
  • OSAT partners

🔹 What We’re Looking For

  • Strong experience in semiconductor packaging (especially with handson assembly process experience such as pre-assembly and wire bonding).  Previous exposure to OSAT ecosystem is an added advantage.
  • Proven ability to manage cross-site, cross-functional projects
  • Solid understanding of NPI/NTI development flows
  • Excellent stakeholder management and communication skills
  • Ability to drive standardization, governance, and technical problem-solving

🌟 Why Join Us

  • Opportunity to lead high-impact package innovation initiatives
  • Work with global teams and OSAT partners for wide exposure and fast knowledge & skill growth
  • Drive technology roadmap and next-generation packaging solutions


More information about NXP in Malaysia...

#LI-633a

Location & Eligibility

Where is the job
Kuala Lumpur, Malaysia
On-site at the office
Who can apply
MY

About this job

Who can apply
Malaysia
Posted
Today
Employer
has 675 open jobs on Jobera in 11 countries.

Listing Details

First seen
October 18, 2026
Last seen
October 18, 2026

Posting Health

Days active
0
Repost count
0
Trust Level
51%
Scored at
October 18, 2026

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External Package Innovation Engineer