Quick Summary
The Package Innovation department is responsible for Package technology development to enable business for NXP by working closely with business teams to successfully launch products.
The Package Innovation department is responsible for Package technology development to enable business for NXP by working closely with business teams to successfully launch products. We work on leading edge technologies for applications in the Automotive (Radar, Radio, Infotainment), IoT (Microcontroller) and Mobile (Payment, NFC, UWB) areas. One of the key areas of growth are related to Radar/RF and mmW applications/products.
Related to this, it is critical to establish and maintain the capability to measure dielectric properties of relevant materials and test structures at very high frequences (> 100 GHz).
Responsibilities
~1 min read- →BSc in Electronic Engineering or relevant experience
- →Affinity with tools and hardware in electronics lab environment
- →Skill and affinity in software development, data processing, and computer engineering.
- →Team worker, willing to work in international and multi-disciplinary teams.
- →Good communication skills, both verbal and in writing, in English
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Location & Eligibility
About this job
- Who can apply
- Netherlands
- Posted
- Today
Listing Details
- Posted
- October 27, 2026
- First seen
- October 27, 2026
- Last seen
- October 27, 2026
Posting Health
- Days active
- 0
- Repost count
- 0
- Trust Level
- 49%
- Scored at
- October 27, 2026
Signal breakdown
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