8mo ago

Senior Packaging Engineer

Malaysia·Ipohsenior

OtherPackaging Engineer

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Quick Summary

Key Responsibilities

define control charts, sample plans, capability studies (Cp/Cpk) and guardbanding for critical steps (die attach, wirebond, mold, trim/form, plating).

Technical Tools

OtherPackaging Engineer

Job Description

We’re hiring a hands-on Resident Package Engineer at a key OSAT partner to support mass production of multi-die wirebond leadframe packages. You will focus on sustaining manufacturing performance, supplier process control, and robust release-to-manufacturing (RTM) protocols to ensure product quality, yield and on-time delivery.

Key responsibilities

Act as the on-site technical owner at the OSAT for all packaging activity; act as primary engineering interface between OSAT operations and our packaging / product teams.
Support and troubleshoot day-to-day production issues (quality holds, yield excursions) and lead root-cause analysis and permanent corrective actions (8-D, RCA).
Implement and maintain RTM artifacts including process flows, control plans, work instructions, and SOPs.
Drive process control and SPC: define control charts, sample plans, capability studies (Cp/Cpk) and guardbanding for critical steps (die attach, wirebond, mold, trim/form, plating).
Oversee supplier change control and PCNs (Process Change Notices), BOM/process releases and supplier qualification runs.
Participate in supplier audits and periodic process/quality audits at the OSAT; capture and escalate nonconformances.
Run process characterization and DOE to improve yield, quality, capacity, and cycle time; document outcomes and update process specs.
Coordinate failure analysis and disposition of discrepant material (with material review board support).
Work with NPI and sustaining teams to transfer new or revised processes into consistent mass production practices.
Report KPIs weekly (yield, DPPM, escape rate, cycle time, open corrective actions).

Required qualifications

B.S. in Electrical, Mechanical, Materials, Chemical engineering or related discipline.
Minimum 2 years’ experience in semiconductor back-end assembly — volume production experience required.
Strong practical knowledge of wirebond processes, leadframe design considerations, clip bonding, plating and molding/encapsulation.
Strong problem solving using 8-D, FMEA, DOE, SPC
Experience with QC/FA tools (cross-section, decap, SEM, X-ray) and reading FA reports.
Excellent communication skills — able to write process specs
Willingness to be based full-time at the OSAT site with occasional travel to Malaysian operations hub in Penang.

Additional preferred qualifications