Staff Package Engineer

Malaysia·George Townlead

OtherEngineer

0 views0 saves0 applied

Apply Now

Quick Summary

Key Responsibilities

To drive improvement on assembly yield, quality, delivery and cost on mass production products. To manage new product introduction at subcontractor factory. To support new products,

Requirements Summary

Bachelor’s degree or above in engineering. Min 8 years of experience in semiconductor assembly process / NPI engineering or assembly subcon management.

Technical Tools

OtherEngineer

Responsibilities

~1 min read

→To drive improvement on assembly yield, quality, delivery and cost on mass production products.
→To manage new product introduction at subcontractor factory.
→To support new products, process and package development.
→To drive investigation and solution on customer complaint case.
→To perform regular process and quality audit at subcontractor site.
→Strong interaction with cross functional team on assembly engineering project.

Requirements

~1 min read

Bachelor’s degree or above in engineering.
Min 8 years of experience in semiconductor assembly process / NPI engineering or assembly subcon management.
Hand-on experience in wire bonding and/or molding process is very desirable.
Possess a good understanding on assembly process control and requirement.
Strong project management and problem-solving skills.
Fluent in English.
Technically competent, self-motivated, strong commitment and assertive