6d ago

DCP-Electronics HW Engineer (Global)-SZ

Chinamid

OtherEngineer

0 views0 saves0 applied

Apply Now

Quick Summary

Overview

Senior Power Electronics Engineer (Shenzhen) Location: Shenzhen,

Technical Tools

OtherEngineer

Responsibilities

~1 min read

→Power Electronics Product Development
- →Lead the design and development of power electronics products, such as inverters, converters, charging modules, and power management systems.
- →Responsible for topology design, component selection, magnetic component design, and thermal design to ensure system performance and reliability.
→Technical Verification & Testing
- →Plan and perform electrical performance, safety, and EMC tests; drive prototype validation and functional debugging.
- →Analyze and resolve technical issues related to electrical design, thermal management, and EMI/EMC during the development process.
→Project Management & Cross-functional Collaboration
- →Participate in project initiation and technical evaluation, define development plans, and ensure on-time delivery.
- →Collaborate closely with global R&D teams, suppliers, and manufacturing teams to support the entire product lifecycle from R&D to mass production.
→Standards & Compliance
- →Ensure designs comply with international and domestic standards (e.g., IEC, UL, GB).
- →Stay up to date with industry trends, advanced technologies, and new components in the field of power electronics, and apply them to product development.
→Team Support & Guidance
- →Provide technical coaching and training to junior and mid-level engineers.
- →Participate in technical reviews and intellectual property development (e.g., patents), contributing to overall R&D capability enhancement.

Requirements

~1 min read

Master’s degree or above in Power Electronics, Electrical Engineering, Automation, or related fields.
5+ years of experience in power electronics product development; background in high-power supplies, PV/storage inverters, EV chargers, or automotive powertrain electronics is a plus.
Solid knowledge of common power electronics topologies (e.g., Buck/Boost, LLC, Full-Bridge, Three-Level). Skilled in magnetic component design and thermal simulation.
Proficient in applying and driving power devices (IGBT, SiC, GaN).
Strong English communication skills, capable of working effectively with overseas R&D teams.
Excellent problem-solving, analytical, and innovative thinking skills.