Defect Characterization Low Yield Analysis Engineer

As a Low Yield Analysis (LYA) Engineer within Intel Foundry's Defect Characterization organization, you will drive root cause identification and yield improvement strategies for advanced packaging assembly and substrate technology development programs. You will lead complex technical investigations, develop innovative characterization methodologies, and collaborate across manufacturing, quality, process integration, design, and module technology development organizations to resolve critical yield challenges.

This role requires a strong sense of ownership, urgency, technical leadership, and customer focus. The successful candidate will independently drive investigations, influence technical decisions, mentor team members, and deliver measurable business impact through yield improvement and defect characterization excellence.

• →Lead end-to-end investigations to identify and resolve complex yield, defect, and quality issues.
• →Serve as a technical owner for major factory, platform, or technology development programs.
• →Define characterization strategies, learning plans, and root cause methodologies for critical technical challenges.
• →Utilize advanced analytical techniques including Optical Microscopy, SEM/EDS, EBSD, CSAM, FTIR, Raman, FIB, ion milling, and mechanical cross-sectioning to identify failure mechanisms.
• →Correlate characterization results with electrical data, defect inspection data, process history, and manufacturing information to establish root cause.
• →Consolidate and analyze large data sets using statistical methods and coding tools to identify yield limiters and emerging trends.
• →Develop and implement tools, dashboards, automation, and analytical methodologies that improve learning velocity and analysis efficiency.
• →Drive corrective actions and influence process improvements across manufacturing, integration, quality, and technology organizations.
• →Lead cross-functional task forces and technical reviews to address high-priority yield and reliability issues.
• →Present technical findings, recommendations, and risk assessments to engineering and management teams.
• →Mentor engineers and technicians while promoting best-known methods and organizational learning.
• →Support future capability development through equipment strategy, methodology development, and characterization roadmap planning.
• →Effectively manage multiple high-priority investigations while balancing customer commitments, factory priorities, and business needs.

• Demonstrated success managing multiple competing priorities in a fast-paced manufacturing or development environment.
• Communicate findings verbally and through reports to yield engineers, LYA analysts, and other customers.
• Work in a collaborative manner with a variety of different individuals in a fast paced, technical environment.
• Experience independently driving technical investigations and root cause analysis activities.
• Independently own open-ended technical problems, proactively drive actions across organizations, and deliver measurable business impact through root cause identification and implementation of corrective actions.
• Problem-solving, analytical, and troubleshooting skills.
• Verbal and written communication skills to communicate technical findings to diverse audiences.
• Operate effectively in ambiguous environments and drive technical issues to closure with minimal direction.

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum qualifications and are considered a plus factor in identifying top candidates.

Experience listed below would be obtained through schoolwork and/or classes and/or project work and/or internships and/or military training and/or work experience.

• Master's Degree in Materials Science and Engineering, Mechanical Engineering, Chemical Engineering, Electrical Engineering, or Chemistry and Physics or related field with 3+ years of relevant semiconductor industry or failure analysis lab experience OR PhD in Materials Science and Engineering, Mechanical Engineering, Chemical Engineering, Electrical Engineering, or Chemistry and Physics or related field.

• Prior experience working in a lab environment with hands-on experience with failure analysis and characterization techniques such as Optical Microscopy, SEM/EDS, CSAM, FTIR, Raman, TEM, EBSD, XRD or similar methodologies.
• Experience with mechanical cross-sectioning, planar grinding, ion milling, focused ion beam (FIB), and advanced sample preparation techniques.
• Advanced knowledge of semiconductor packaging, assembly, substrate manufacturing, or related process technologies.
• Proficiency with statistical analysis and data analytics tools such as Python, JMP, JSL, SQL, or equivalent.
• Track record of mentoring engineers and technicians and contributing to organizational capability development.
• Experience developing new characterization techniques, analytical workflows, or problem-solving methodologies.

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