21d ago

Senior Package Layout Engineer - Hardware

6 Locationssenior

Other

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Quick Summary

Key Responsibilities

As part of a Layout team, you will collaborate to implement high speed/density ASIC packages. Perform substrate breakout patterns for ASIC packages.

Requirements Summary

Hold a B.S. Electrical Engineering or equivalent experience 5+ years experience in PCB Layout of graphics cards, motherboards, line cards or other related technology.

Technical Tools

Other

NVIDIA's GPUs and SOCs are the world leaders in power, performance and efficiency. We are continually innovating to deliver new and creative, unusual solutions to extraordinary problems in a wide range of sectors. To this purpose, we are now seeking a hard-working Senior Package Layout Engineer who is committed to making a difference in the world through their contributions!

This position will collaborate with Technical Package Lead and different design teams in the design and development of sophisticated, detailed layout of IC substrates for NVIDIA products. In addition, work with design teams to plan schedules, resolve costs, manufacturing, and electrical design issues.

Responsibilities

~1 min read

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As part of a Layout team, you will collaborate to implement high speed/density ASIC packages.
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Perform substrate breakout patterns for ASIC packages.
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Optimize package pinout incorporating system level trade-offs of pins assignment.
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Help perform package routing, placement, stack-up, reference plane and power distribution using Cadence APD or SiP tool suite.
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Propose layout design trade-offs to the Technical Package Lead for resolution and implementation.
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Conduct design feasibility studies to evaluate the Package design goals for size, cost, and system performance.
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Develop symbols and CAD library databases using Cadence APD design tools
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Develop methodologies to improve layout productivity

Requirements

~2 min read

Hold a B.S. Electrical Engineering or equivalent experience
5+ years experience in PCB Layout of graphics cards, motherboards, line cards or other related technology. Experience with HDI designs is a plus
Proven experience in substrate layout of wire bond and flip chip packages, preferred
Significant background with Cadence APD or SiP and/or PCB layout tools (including Constraint Manager)
Solid understanding of high-speed design signal integrity practices
Experience with Virtuoso and Calibre is a plus
Experience using Valor is helpful

NVIDIA is widely considered to be one of the technology world’s most desirable employers! We have some of the most forward-thinking and dedicated people in the world working for us. If you're creative and autonomous, we want to hear from you.

#LI-Hybrid

Your base salary will be determined based on your location, experience, and the pay of employees in similar positions. The base salary range is 136,000 USD - 212,750 USD for Level 3, and 168,000 USD - 258,750 USD for Level 4.

You will also be eligible for equity and benefits.

Applications for this job will be accepted at least until October 20, 2026.

This posting is for an existing vacancy.

NVIDIA uses AI tools in its recruiting processes.

NVIDIA is committed to fostering an inclusive work environment and proud to be an equal opportunity employer. As we highly value diversity in our current and future employees, we do not discriminate (including in our hiring and promotion practices) on the basis of race, religion, color, national origin, gender, gender expression, sexual orientation, age, marital status, veteran status, disability status or any other characteristic protected by law.