1mo ago

Senior Package Layout Engineer

IsraelIsrael·Yokneamsenior
Other
2 views0 saves0 applied

Quick Summary

Key Responsibilities

As part of a IC Packaging design team, you will collaborate to implement high speed and PDN design for ASIC packages. Develop symbols, pad stack and perform substrate package routing, placement,

Requirements Summary

B.Sc.

Technical Tools
Other

NVIDIA Networking unit has continuously reinvented itself over two decades. Our high-speed products are leading in the markets with innovative ways to improve speed and bandwidth from one generation to another. Today, we are increasingly known as the place for getting “End-to-End High-Speed Ethernet and InfiniBand Solutions. We're looking to grow our company and build our teams with smart people who can join us at the forefront of technological advancement. NVIDIA IC Packaging design team is looking for a Senior IC Packaging Design Engineer to join our package team. and focus on delivering and designing state of the art high-speed Interconnect systems for Supercomputers and Datacenters. This position will collaborate with Technical Package Lead and cooperation with different design teams and development of complex, detailed layout of IC substrates for NVIDIA products.

Responsibilities

~1 min read
  • →

    As part of a IC Packaging design team, you will collaborate to implement high speed and PDN design for ASIC packages.

  • →

    Develop symbols, pad stack and perform substrate package routing, placement, stack-up, reference plane, power distribution using Cadence APD (Allegro) or SiP tools.

  • →

    Optimize package pin out incorporating system level trade-offs of pins assignment.

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    Develop methodologies to improve layout environment, productivity, reliability, and schedule considerations.

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    In close co-operation with the SI/PI/HW design teams and product teams

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    Planning, ensuring stakeholder management and leading projects from start to finish

Requirements

~1 min read
  • B.Sc. Electrical Engineering or an Electrical Practical Engineer certificate or equivalent experience

  • 5+ years hands-on in Package/PCB Layout and outing experience; including high speed design signal integrity practices.

  • Experience in substrate layout of wire bond and flip chip packages, preferred

  • Knowledge in substrates or board manufacturing process

  • Significant background with Cadence Virtuoso and APD (Allegro) or SiP and/or other PCB layout tools

  • Knowledge in Ansys (SIwave, HFSS) or Cadence (Sigrity, PowerSI) simulation tools

  • Familiarity with Skill language (Cadence) and basic parsing abilities (Python/Perl/Shell-scripting)

NVIDIA have some of the most forward-thinking and hardworking people in the world working for us and, due to unprecedented growth, our exclusive engineering teams are rapidly growing. If you're a creative and autonomous engineer with a real passion for technology, we want to hear from you. We are committed to fostering a diverse work environment and proud to be an equal opportunity employer. As we highly value diversity in our current and future employees, we do not discriminate (including in our hiring and promotion practices) on the basis of race, religion, color, national origin, gender, gender expression, sexual orientation, age, marital status, veteran status, disability status or any other characteristic protected by law.

Location & Eligibility

Where is the job
Yokneam, Israel
On-site at the office
Who can apply
IL

About this job

Who can apply
Israel
Posted
37 days ago
Employer
has 3,321 open jobs on Jobera in 29 countries.

Listing Details

Posted
September 29, 2026
First seen
October 18, 2026
Last seen
November 4, 2026

Posting Health

Days active
17
Repost count
0
Trust Level
14%
Scored at
November 5, 2026

Signal breakdown

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Senior Package Layout Engineer