Senior Failure Analysis Engineer

United States·Santa Clara

Other

0 views0 saves0 applied

Apply Now

Quick Summary

Key Responsibilities

Develop Advanced FA Techniques & Methodologies Pioneer Novel Methods: Design and implement cutting-edge methodologies to drive successful root-cause investigations on leading-edge silicon,

Requirements Summary

Domain Expertise: Deep understanding of semiconductor IC fabrication, advanced packaging/assembly processes, and advanced failure analysis methodologies.

Technical Tools

Other

NVIDIA is the pioneer of GPU-accelerated computing and the engine powering the global AI revolution. We build the full-stack AI infrastructure, advanced microelectronics, and hardware ecosystems that drive everything from massive data center AI factories to autonomous vehicles, robotics, and advanced scientific simulation. Physical Failure Analysis team is relentlessly committed to quality, pushing the boundaries of semiconductor innovation and hardware reliability.

We are seeking a highly skilled and motivated Failure Analysis Engineer to join our world-class Failure Analysis Lab. In this role, you won’t just solve problems—you will work at the dynamic intersection of physics, process technology, physical design, and circuit design to investigate complex product failures and drive critical engineering solutions. The Mission: Perform Physical Failure Analysis (PFA) on some of the world’s most advanced integrated circuits, deep learning processors, and system architectures, uncovering root causes that directly shape the future of computing. We are looking for an adaptable technical expert capable of translating open-ended challenges into actionable insights. If you excel in fast-paced environments and want to help build the infrastructure defining the modern era, we encourage you to apply.

Responsibilities

~1 min read

Develop Advanced FA Techniques & Methodologies

→
Pioneer Novel Methods: Design and implement cutting-edge methodologies to drive successful root-cause investigations on leading-edge silicon, advanced heterogeneous packaging technologies, and complex integrated systems.
→
Precision De-processing: Perform mechanical cross-sectioning, parallel de-layering, and advanced chemical/plasma de-processing of integrated circuit (IC) devices across die, package, component, and board levels.
→
Nanoscale Analysis: Apply advanced Focused Ion Beam (FIB) sample preparation and analysis techniques to enable high-resolution electrical and physical diagnostics of IC chips.
→
Innovate Characterization Platforms: Develop novel characterization techniques and specialized analysis platforms tailored for emerging chip structures with advanced silicon architectures and complex packaging schemes.
→
Optimize Workflows: Design and implement robust failure analysis (FA) workflows to improve laboratory efficiency and guarantee accurate, reproducible root-cause determination.

Conduct In-Depth FA Investigations

→
Lead Root-Cause Investigations: Head high-impact failure analysis investigations to isolate the root causes of critical failures affecting product yield, performance, and long-term reliability.
→
Support multi-functional Engineering: Deliver precise physical characterization data to support engineering teams with Design of Experiments (DOE) evaluations, design optimization, process node improvements, and critical customer FA requests.

Requirements

~2 min read

Domain Expertise: Deep understanding of semiconductor IC fabrication, advanced packaging/assembly processes, and advanced failure analysis methodologies.
Sample Preparation: Proven proficiency in precision IC device sample preparation for targeted defect localization and physical root-cause analysis.
Microscopy & Inspection: Hands-on expertise with advanced Optical and Electron microscopy (SEM/TEM), alongside related analytical inspection techniques.
System-Level Analysis: Strong working knowledge of physical and electrical failure analysis across die, package, component, and board levels.
Education & Experience: A B.S., M.S., or Ph.D. in Electrical Engineering, Materials Science, Physics, or closely related field (or equivalent experience),
paired with 8+ years of relevant, hands-on industry experience.

With competitive salaries and a generous benefits package, NVIDIA is widely considered to be one of the technology world’s most desirable employers. We have some of the most hard-working and dedicated people in the world working for us and, due to unprecedented growth, our best-in-class engineering teams are rapidly growing. If you're a creative and autonomous engineer with a real passion for technology, we want to hear from you.

Your base salary will be determined based on your location, experience, and the pay of employees in similar positions. The base salary range is 144,000 USD - 230,000 USD.

You will also be eligible for equity and benefits.

Applications for this job will be accepted at least until July 24, 2026.

This posting is for an existing vacancy.

NVIDIA uses AI tools in its recruiting processes.

NVIDIA is committed to fostering an inclusive work environment and proud to be an equal opportunity employer. As we highly value diversity in our current and future employees, we do not discriminate (including in our hiring and promotion practices) on the basis of race, religion, color, national origin, gender, gender expression, sexual orientation, age, marital status, veteran status, disability status or any other characteristic protected by law.