SR ENGINEER, ADVANCED PROCESS DEVELOPMENT

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

The successful candidate will be responsible for development, optimization, qualification, and technology transfer of advanced packaging assembly processes, with primary focus on hybrid bonding / advanced die stacking technologies for HBM and next-generation products. Assembly process development, hybrid-bond paths, C2W activities, qualification, and transfer work.

• Bachelor's or Master's degree in Materials Science, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Semiconductor Engineering, Physics, or related discipline.
• Strong understanding of semiconductor assembly, wafer-level packaging, or advanced packaging processes.
• Hands-on experience in process development, process integration, equipment engineering, or manufacturing engineering.
• Strong knowledge of DOE, SPC, process capability, statistical analysis, FMEA/pFMEA, and structured problem-solving methodologies.
• Ability to perform systematic data analysis, failure analysis, root-cause identification, and process optimization.
• Understanding of semiconductor NPI, process qualification, change control, and technology-transfer methodology.
• Ability to establish process windows and translate development learning into manufacturable process controls.

• Experience with hybrid bonding, direct bonding, Cu-Cu bonding, C2W, W2W, or high-accuracy die stacking.
• Understanding of hybrid-bonding critical factors such as: Surface preparation and cleanliness Particle/contamination control Bond interface quality Alignment accuracy Wafer/die warpage Bonding temperature/pressure/process window Post-bond inspection and defect analysis
• Knowledge of upstream/downstream advanced assembly processes such as wafer preparation, cleaning, dicing, die handling, bonding, encapsulation, thinning, and metrology.
• Experience with advanced packaging / HBM manufacturing environments.

We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.

To learn more, please visit micron.com/careers

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

To request assistance with the application process and/or for reasonable accommodations, please contact at hrsupport_taiwan@micron.com.

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.

AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification.   

Fraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the About Micron Technology, Inc.