Packaging Research and Development Engineer

United States·Phoenixmid

Other

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Quick Summary

Key Responsibilities

- Define and establish equipment configurations, process specifications,

Requirements Summary

You must possess the below minimum qualifications to be initially considered for this position.

Technical Tools

Other

Substrate Packaging Technology Development (SPTD) is looking for a Packaging Research and Development Engineer to join the Module Engineering Backend Area specifically to be in charge of process and material development to scale advanced substrate packaging technology to enable further die disaggregation / heterogenous integration.

This position requires most of time spent on the factory floor and/or interacting with equipment/material suppliers. The candidate will join and become part of a world class first of a kind embedded die packaging facility, learn advanced substrate manufacturing know-how, drive disruptive technology innovations, and be part of creating history in the substrate packaging industry.

Responsibilities will include but not be limited to:

Requirements

~1 min read

What We Offer

~1 min read

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

Location & Eligibility

Where is the job

Phoenix, United States

On-site at the office

Who can apply

About this job

Pay per year: $133,800–$188,890 a year; 139% above the $67,411 median for Other jobs on Jobera (143,204 salaries).
Who can apply: United States
Posted: 19 days ago
Employer: has 1,583 open jobs on Jobera in 15 countries.