Principal Electromechanical Engineer

Join Northrop Grumman – Cincinnati (aka Xetron), part of Mission Systems sector, focused on the development of new capabilities for our military and intelligence customers around the globe. Our Northrop Grumman Cincinnati, Ohio small business culture operates collaboratively within a larger corporation providing the benefits of both.  This unique relationship offers employees the ability to know everyone at the site while working on technologies and products that are beyond state-of-the-art. You and your team will wrestle with the next big problems in an atmosphere of collaboration and cooperation, sharing your expertise while learning from the expert next to you. Remember when you were excited about getting to work because of the challenge of the problem, the importance of the solution and the fun you had with your team?  It's that kind of place!  But don’t take my word for it, see for yourself!  See why we receive comments on our YouTube Videos like “This company is insanely advanced” and “Wow. This is mind blowing.”  See some of our recent Awards and Recognition and read about some of the reasons to live in Cincinnati.

We are seeking cleared Electromechanical Engineer to develop our enclosures and chassis in support of hardware systems onsite in Cincinnati, OH.  The products produced at this facility support all domains of intelligence and defense battlespaces including land, sea, air and space.

This position will support the development, build, and test validation of electronic equipment for defense and intelligence applications. The candidate will work within the Hardware Engineering organization. It is a high performing organization that values its employees and has a strong sense of purpose tied to the vision of Northrop Grumman: To be the most trusted provider of systems and technologies that ensure the security and the freedom of our nation and its allies. The candidate will be able to grow personally and professionally in an ethical and inclusive environment, while being an important part of a great team.

• Mission‑Driven Work: Directly contribute to systems that safeguard nations and support critical national‑security objectives
• Rapid Growth Environment: Play a pivotal role on fast‑moving programs that are expanding quickly, giving you ownership and visibility
• Cross‑Functional Influence: Collaborate with engineering, manufacturing, quality, and supply‑chain teams, and become a trusted advisor to senior leadership and external partners
• Participate in and lead detail-level and assembly-level design, drawing development, design reviews, release for manufacture, and follow through to production and test phases
• Support all phases of the system’s lifecycle including design, drawings, fabrication, test, installation, operation and maintenance
• Interface with vendors to meet mechanical requirements including thermal, vibration and structural requirements and analysis.

Typical teams are 5-10 people and require our engineers to have diverse skill sets that apply to the entire lifecycle of a program. This position allows the candidate to have direct contact with our end customers and end operators of our products, which allows for pragmatic and early feedback from the user community during the design process. Preferred technical background includes experience with collaborating across engineering teams to resolve and integrate technical/engineering requirements and verify their incorporation into the resulting product.

• Bachelor’s Degree in Mechanical Engineering or other STEM field with 5 years of experience or Master’s degree n Mechanical Engineering or other STEM field with 3 years of experience; or PhD n Mechanical Engineering or other STEM field with 1 year of experience
• U.S Citizenship is required
• An active U.S Government Top Secret clearance is required with ability to obtain Special Program Access (SAP)
• Ability to work 100% onsite.
• Experience with mechanical design of electro-mechanical packaging, system integration and support and hardware development
• Proficiency with 3D CAD Tools (Siemens NX is preferred)

• Master of Science degree in Mechanical or Aerospace Engineering or currently pursuing.
• Demonstrated leadership during the product development process including the review of technical work products
• Experience in design, manufacturing, and integration of electronic assemblies including appropriate material selections and use of off-the-shelf components
• Experience with thermal and structural analysis tools and methodologies

• Experience in design, manufacturing, and integration of electronic assemblies including printed circuit board design, appropriate material selections and use of off the shelf components.

• Experience of demonstrated application of innovative solutions to complex problems that arise within the design, development, and production phases
• Strong written, verbal and interpersonal communication skills including experience presenting at design reviews
• Familiarity with contributing to technical and cost proposal development
• Working knowledge of military and commercial process specifications included in MIL-STD 810
• Experience interfacing with vendors and customers (i.e. customer/stakeholder briefings)
• Experience with geometric dimensioning and tolerancing (GDT)