Senior Staff Engineer Unit Process Development Die Attach

Lead process development activities including process parameter scouting, optimization, verification, qualification, and Process Freeze to achieve project targets in quality, manufacturability, cost competitiveness, and timeline. Drive technical handover and knowledge transfer activities to manufacturing Operations, ensuring smooth implementation and sustainable production performance. Support prototype builds, engineering samples, and development lots throughout the product development lifecycle. Develop, review, and maintain technical documentation including Process Specifications, PFMEA, DFMEA, OJTI, T32, PDR, and other development-related documents. Provide ownership and technical input for Process of Record (POR), Assembly Design Rules, Process Roadmaps, Failure Catalogues, Control Plans, Maintenance Checklists, and similar engineering documentation. Collaborate with suppliers to evaluate, verify, qualify, and implement new materials, tooling, equipment, and process technologies while driving continuous improvement initiatives. Lead complex problem-solving task forces and technical focus teams using structured methodologies and statistical tools such as SPC, APC, DOE, 8D, PFMEA, and DFMEA. Identify, assess, and develop next-generation Die Attach technologies and process capability improvements to support future business and technology requirements. Support the selection and definition of process technologies, materials, machine platforms, and tooling concepts for development projects. Provide technical coaching, mentorship, and guidance to engineers and project teams while fostering knowledge sharing and capability development. Initiate, generate, and drive intellectual property (IP) creation activities through technical research, innovation, and technology scouting. Lead critical technical topics and focus-of-knowledge (FOK) initiatives across development projects and manufacturing sites to ensure successful technology deployment and risk mitigation. Master's or Bachelor's Degree in Engineering, Materials Science, Chemical Engineering, Semiconductor Technology, Microelectronics, Mechanical Engineering, Electrical Engineering, Electronics Engineering, or a related technical discipline. Minimum 8 years of experience in semiconductor manufacturing, with strong expertise in assembly process development and semiconductor packaging technologies. Strong hands-on experience in Die Attach process development, process optimization, technology transfer, and manufacturing support. Solid knowledge of semiconductor assembly processes, materials, equipment platforms, and process integration methodologies. Strong analytical and problem-solving skills with the ability to resolve complex technical challenges in development and manufacturing environments. Experience in statistical analysis, process characterization, and Design of Experiments (DOE) for process optimization and qualification activities. We are on a journey to create the best Infineon for everyone. We strive to create the best Infineon for everyone by embracing diversity and inclusion. We welcome applicants for who they are and offer a workplace built on trust, openness, respect and equal opportunity. Our hiring decisions are based on skills and experience. Even if you don't meet every requirement, we encourage you to apply. Please let your recruiter know if you need any accommodations during the interview process. Learn more about our various contact channels and about Diversity & Inclusion at Infineon.