Semiconductor Research Engineer

As a Semiconductor Research Engineer, you will play a crucial role in advancing Intel's assembly and packaging technologies. You will design, develop, and test innovative devices, interconnects, and packaging solutions, leveraging device physics, electromagnetics, and materials science. Your hands-on work will include prototyping and research to optimize performance, reliability, and cost, directly impacting Intel's technological leadership in semiconductor innovation.

Intel Corporation's Assembly Materials Characterization Lab, in Core Competency of Advanced Design and Customer Enabling is dedicated to enabling next-generation semiconductor technologies. This group combines cutting-edge research and development to deliver next generation metrology solution for advanced packaging solutions that drive miniaturization, performance enhancements, and functionality. As part of this dynamic team, you will contribute to Intel's mission to enhance technological capabilities and maintain industry leadership.

• →Conduct research using device physics, optics, electromagnetics, and thermomechanical analysis to enable novel devices and packaging technologies.
• →Design and fabricate metrology prototypes to validate groundbreaking concepts for semiconductor assembly and interconnect solutions.
• →Develop testing methodologies for component and device characterization, including dimension, optical signal loss, and stressing.
• →Plan and execute experiments with cross-functional teams to benchmark results against industry standards.
• →Model and analyze trade-offs between design, performance, and reliability to ensure optimal solutions.
• →Collaborate with external vendors and researchers to support Intel's research pipeline.

• Lead and influence technical teams to achieve milestones.
• Analytical and problem-solving abilities to address unique engineering challenges.
• Excellent organizational and communication skills, with experience presenting findings and mentoring team members.

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum qualifications and are considered a plus factor in identifying top candidates. 

• Master's in Electrical Engineering, Physics, Materials Science, Mechanical Engineering, or a related field with 4+ years of experience- OR- PhD degree with 2+ years of experience.
•  Experience mentioned above should be in the following areas:
  • Research, including optical test metrology, Dimensional metrology, and packaging design methodologies.
  • Programming skills in Python or MATLAB for engineering applications.
  • Experimental setups and data analysis techniques for lab testing.

• Experience with advanced Co-Packaged Optics (CPO).
• Experience with advanced packaging technologies like EMIB and Foveros architectures.
• Expertise in Design of Experiments (DOE), statistical analysis methods, and model-based problem-solving techniques.
• Familiarity with materials characterization techniques and cross-disciplinary collaboration.

Join a team that thrives on innovation, collaboration, and excellence. Be part of shaping the future of semiconductor technology with Intel-apply today.

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