Semiconductor Research Engineer

Malaysia·Kulimmid

Software EngineeringSearch Engineer

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Requirements Summary

Master's degree with 1 to 2 years of relevant experience or PhD in Mechanical Engineering with expertise in CFD or FEA, and experience in design parametric studies and electronic packaging.

Technical Tools

Software EngineeringSearch Engineer

As a Semiconductor Research Engineer, you will drive hands-on research and competency development to advance Intel's future assembly packaging platform technologies. Using CFD/FEA simulation, you will define electronic packaging manufacturability and design optimization windows, solving complex technical challenges and delivering high-impact solutions that support Intel's technology roadmap.

Business Group
You will join the Advanced Design and Customer Enabling group in Intel Foundry, a global semiconductor manufacturing leader driving design innovation and high-density electronic packaging. The group leverages cutting-edge materials, processes, and computational techniques to deliver advanced packaging assembly technologies.

Key Responsibilities

Develop and implement Computational Fluid Dynamics (CFD) and Finite Element Analysis (FEA) simulations for electronic packaging design assessment, and conduct research and core competency development to build predictive capabilities.
Apply scientific principles to develop and assess novel electronic packaging concepts ahead of physical prototyping till high volume manufacturing.
Build prototypes and conduct lab-scale experiments for visualization and validation.
Conduct parametric studies and propose innovative solutions for design optimization and performance improvement.
Lead external vendor engagements and mentor academic and industry research collaborations.

Requirements

~1 min read

Master's degree with 1 to 2 years of relevant experience or
PhD in Mechanical Engineering with expertise in CFD or FEA, and experience in design parametric studies and electronic packaging. Fresh graduates are encouraged to apply.
Proficiency in Fluent, Ansys, Abaqus, Python, MATLAB, and VS Code for analysis tool automation and AI integration.
Familiarity with design of experiments (DOE) and materials characterization techniques.
Fundamental understanding of flip-chip and advanced packaging anatomy and assembly processes.
Strong communication and collaborative problem-solving skills.
Experience in external collaborations and academic mentorship.
Hands-on research capability with disciplined execution and clear research vision.

Experienced Hire

Shift 1 (Malaysia)

Malaysia, Kulim

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

N/A

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.