HVM Field Process Engineer – tALD, Epitaxy, Vertical Diffusion

As a member of the Global Sales and Services business unit, our Field Process Engineering team is the on-site process application expert in improving process performance and stability on our tool sets at our customer locations.  In this role you will be supporting Thermal Atomic Layer Deposition (tALD), Epitaxy or Diffusion on ASM’s XP8 DCM/QCM, Intrepid or Sonora platforms. You will optimize deposition processes, resolve technical issues, and ensure tool performance meets customer and ASM requirements. This role is ideal for engineers who enjoy hands‑on problem‑solving, fast‑paced environments, and contributing to next‑generation semiconductor manufacturing.

The Field Process Engineer is a key customer interface and must demonstrate responsibility and proper communication when interacting with the customer. Delivering customer satisfaction is a key objective in this role. Engineers in this role often transition into technical leadership, customer strategy, or product development roles. You’ll have visibility across ASM’s global innovation teams and access to advanced R&D resources.

• →Lead on-site process qualification and optimization during tool installs and ramp‑up.
• →Trace achievement of customer specifications through installation, ramp, and warranty phases.
• →Execute structured DOEs to improve film quality, uniformity, and throughput.
• →Troubleshoot process issues using systematic root‑cause analysis. Drive containment, short‑term mitigation, and long‑term corrective actions to ensure customer requirements are met.
• →Partner with customer and ASM teams to drive continuous improvement and tool‑to‑tool matching.
• →Develop, maintain, and ensure relevance of technical information used by internal and external stakeholders – especially sharing lessons learned within our key account organization and Global Sales and Services business unit.

• Serve as a primary technical interface between customer process teams, hardware teams, and ASM account teams.
• Anticipate needs and provide sustainable, long-term solutions.
• Support escalations with clear communication, action plans and disciplined follow‑through.
• Represent ASM with professionalism and technical credibility.

• Clear communication, strong troubleshooting methodology, and ability to stay composed under pressure.
• Highly collaborative, organized, and proactive in solving issues and driving improvements.
• Strong sense of ownership, accountability, and empathy for customer challenges.
• Adaptable to changing priorities in a high‑volume manufacturing environment.

• Master’s or PhD in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or related fields.
• Experience with deposition processes (tALD/Epitaxy/Diffusion), vacuum systems, metrology, and semiconductor manufacturing.
• Preference for candidates with HVM experience, ideally on ASM platforms.
• Strong DOE and experimental analysis skills.
• Ability to travel up to 25%, as necessary and possibly for extended periods of time for training and technical engagement, as well as to other Customer sites, as needed.
• In case of escalations, additional hours and working weekends may be required.
• Strong understanding of IP boundaries and confidentiality requirements

We make the tech that enables the chips in devices which improve lives around the world. We do this with an eye to the future, pushing the boundaries of what’s possible through cutting-edge innovation, and driving the next wave of technological breakthroughs that shape how we live, work, and connect.

To learn more about ASM, find us at asm.com and on LinkedIn, Facebook, Instagram, X and YouTube.

ASM is an equal opportunity employer and considers qualified applicants for employment without regard to race, color, religion, age, nationality, social or ethnic origin, sexual orientation, gender, gender identify or expression, marital status, pregnancy, political affiliation, disability, genetic information, veteran status, or any other characteristic protected by law.