~1h ago
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Wire Bond Maintenance Manager

MalaysiaMalaysia·Serembanmid
Maintenance ManagerConstruction & Real Estate
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Quick Summary

Overview

Wire Bond Maintenance Manager Job Summary Lead the maintenance organization to maximize equipment uptime, reliability, and manufacturing productivity for Wire Bond operations.

Technical Tools
Maintenance ManagerConstruction & Real Estate

Lead the maintenance organization to maximize equipment uptime, reliability, and manufacturing productivity for Wire Bond operations. Drive preventive maintenance strategies, equipment reliability improvement, cost optimization, and team development to support production and business objectives.

Responsibilities

~1 min read
  • →Lead and develop a team of Maintenance Engineers and Technicians.
  • →Develop and implement preventive and predictive maintenance strategies for Wire Bond equipment.
  • →Drive Overall Equipment Effectiveness (OEE) improvement initiatives.
  • →Minimize equipment downtime and improve Mean Time to Repair (MTTR) and Mean Time Between Failures (MTBF).
  • →Lead equipment reliability and continuous improvement projects to enhance manufacturing performance.
  • →Manage spare parts inventory, maintenance resources, and budget effectively.
  • →Support new equipment installation, qualification, buy-off, and production ramp activities.
  • →Ensure preventive maintenance (PM) compliance and maintenance effectiveness across all Wire Bond equipment.
  • →Lead root cause analysis and corrective actions for major equipment failures and recurring issues.
  • →Collaborate with Process Engineering, Production, and Quality teams to improve equipment performance, yield, and product quality.
  • →Drive cost reduction and maintenance optimization initiatives.
  • →Ensure compliance with Safety, ESD, ISO, and Quality Management System requirements.

Requirements

~1 min read
  • Bachelor's Degree in Mechanical, Electrical, Mechatronics, or a related Engineering discipline.
  • Minimum 10 years of experience in semiconductor manufacturing with strong exposure to equipment maintenance.
  • Minimum 5 years of leadership experience managing Engineering or Maintenance teams.
  • Strong knowledge of Wire Bond equipment and semiconductor assembly manufacturing processes.
  • Experience in equipment reliability, preventive maintenance, troubleshooting, and continuous improvement initiatives.
  • Familiarity with TPM, Lean Manufacturing, SPC, and root cause analysis methodologies.
  • Strong leadership, communication, problem-solving, and project management skills.

As an equal-opportunity employer, Nexperia values diversity not just because it is the right thing to do but because diverse teams perform better. We are dedicated to being inclusive, and a proof point of this dedication is that we were the main partner of the very first Dutch Paralympic Team NL House during the Paris 2024 Paralympic Games. Our recruitment process is inclusive and accessible to all, and we consider all applicants fairly, as well as providing a safe work environment and reasonable adjustments where requested.

In addition, we offer our colleagues the possibility to join employee resource groups such as the Pride Network Group or global and local Women's groups. Nexperia is committed to increasing women in management positions to 30% by 2030.

Location & Eligibility

Where is the job
Seremban, Malaysia
On-site at the office
Who can apply
MY

Listing Details

First seen
October 3, 2026
Last seen
October 3, 2026

Posting Health

Days active
0
Repost count
0
Trust Level
51%
Scored at
October 3, 2026

Signal breakdown

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Wire Bond Maintenance Manager