HIKINEX

CAmid

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Quick Summary

Key Responsibilities

Lead the digital/analog PCB design for space environments. Mentor and oversee junior team members and interns in PCB design. Translate board-level

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Responsibilities

~1 min read

→Lead the digital/analog PCB design for space environments.
→Mentor and oversee junior team members and interns in PCB design.
→Translate board-level requirements into a comprehensive design concept (incorporating architecture, I/Os, key components, power dissipation estimates, FPGA integration, software integration, etc.).
→Collaborate closely with FPGA, software, and test designers to finalize functional concepts and streamline integration.
→Complete or review the schematic capture level design.
→Identify and manage technology and design risks.
→Provide guidance to ensure Design for Manufacture/Test in space environments.
→Supervise and review design layout constraints, parts placement, manufacturing, and assembly drawings.
→Prepare or review lists of long lead items, bills of materials, and ensure parts qualifications for space.
→Conduct and review circuit simulations (using tools like SPICE, Hyperlynx, ADS, etc.) and various design analyses (e.g., worst-case scenarios, FMECA).
→Coordinate with various specialized teams (structural, thermal, packaging, manufacturing, quality assurance, etc.) to conduct necessary reviews for PCB component placement and layout.
→Oversee board assembly and manufacturing tests.
→Prepare and review various documents, including review presentations, test plans, test procedures, etc.
→Lead and guide junior team members in testing, troubleshooting, and debugging complex mixed-signal boards.
→Provide support for environmental and functional tests and validation for space missions.
→Report progress and address issues to the program lead or manager.

Requirements

~1 min read

Bachelor’s degree in electrical engineering, computer engineering, or equivalent field.
Minimum of seven (7) years of experience in designing processor, digital, analog, high-speed, or mixed-signal PCBs.
Demonstrated expertise in at least one of these areas of competence.
Proficiency in coaching and supervising junior team members and interns.
Experience in design architecture and handling multidisciplinary specifications and reviews (FPGA, software, mechanical, etc.).
Proficiency in tools/software languages such as Excel spreadsheets, Python, MathCAD, Spice, Matlab, JIRA, etc.
Strong understanding of electronic circuits and communication protocols, coupled with extensive PCB design experience.
Knowledge of PCB manufacturing processes.
Exposure to mechanical packaging is a valuable asset.
Experience conducting analyses (FMECA, WCA, signal integrity, power integrity, etc.) using various tools like SPICE, ADS SiPro, Hyperlynx, etc.