23d ago

Senior Process Technician (Die Prep, Wirebond, Die Attach, Mold, STF, Test)

Malaysia·Malaccasenior

Manufacturing & ProductionProcess Technician

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Quick Summary

Key Responsibilities

Perform technical tests and experiments for engineering in the wafer fabrication area of semiconductor manufacturers Monitor,

Requirements Summary

Diploma in any technical related field, or any engineering relevant background Minimum 5 years of experiences in semiconductor field with experiences in wirebond, die bond, die prep, trim&form, mold,

Technical Tools

Manufacturing & ProductionProcess Technician

Responsibilities

~1 min read

→Perform technical tests and experiments for engineering in the wafer fabrication area of semiconductor manufacturers
→Monitor, audit and provide guidance to line operators once the product is on the line
→Test new products and provide technical assistance to process development and engineering personnel

Requirements

~1 min read

Diploma in any technical related field, or any engineering relevant background
Minimum 5 years of experiences in semiconductor field with experiences in wirebond, die bond, die prep, trim&form, mold, or test as process technicians

Ability to identify, multi-task, and resolve multiple priority issues quickly and efficiently to improve overall ATperformance
Ability to learn and understand process flow quickly, and support the engineering organization as needed
Outstanding organizational, teaming, and troubleshooting skills on electrical and mechanical systems
Exceptional attention to detail