Quick Summary
Overview
Join us as a Staff Engineer Tape Out Enablement and play a critical role in enabling complex semiconductor designs from development to manufacturing. Work alongside global teams,
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Join us as a Staff Engineer Tape Out Enablement and play a critical role in enabling complex semiconductor designs from development to manufacturing. Work alongside global teams, drive process improvements, and contribute to technologies that power a greener, smarter, and more connected world. Your role Key responsibilities in your new role Be
responsible for enabling tapeouts at external fabs and transfers from in house.
Be
for all tapeout aspects the technical interface to the foundries of interest
and responsible for building and maintaining relationships for successful
tapeout enablement. As
Work Package Contributor in NTI and NPI projects be responsible for planning
and tracking of high-quality and in-time tapeout deliveries. Partner
with cross-functional teams, including technology development, design and
manufacturing for a seamless technical support while handling at the same time
shifting priorities and timelines. Actively
contribute to the definition, implementation and documentation of the best fit
to the internal gds2mask and tapeout management system. Work
closely with relevant stakeholders, both internal and at external abs, to
implement robust and efficient tapeout processes along the qualification and
production flows. Provide
technical guidance and support to internal design teams on foundry-specific
design, verification and tapeout requirements. Your profile Qualifications and skills to help you succeed A
degree in Electrical Engineering, Physics or a similar discipline. Minimum
6+ years of experience in semiconductor industry, with a focus on new
technology development, physical design and tapeout enablement. In-depth
knowledge of semiconductor manufacturing processes and technologies in CMOS,
FinFET, etc. Experience
with physical verification and signoff tools (e.g., Cadence, Synopsys, etc.) Proven
experience with foundries (TSMC, GlobalFoundries, UMC, etc.). Familiarity
with mask and data preparation tools and methodologies isa PLUS. Affinity
to or experience with AI-driven application in semiconductor design and
manufacturing. Strong technical leadership and communication
skills, with experience of working in cross-functional teams and collaborating
with senior management. Ability
to work in an international, multicultural and multidisciplinary environment. #WeAreIn for driving decarbonization and digitalization. As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener. Are you in? We are on a journey to create the best Infineon for everyone. We strive to create the best Infineon for everyone by embracing diversity and inclusion. We welcome applicants for who they are and offer a workplace built on trust, openness, respect and equal opportunity. Our hiring decisions are based on skills and experience. Even if you don’t meet every requirement, we encourage you to apply. Please let your recruiter know if you need any accommodations during the interview process. Learn more about our various contact channels and about Diversity & Inclusion at Infineon.
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About this job
- Posted
- Today
Listing Details
- Posted
- November 11, 2026
- First seen
- November 11, 2026
- Last seen
- November 11, 2026
Posting Health
- Days active
- 0
- Repost count
- 0
- Trust Level
- 56%
- Scored at
- November 11, 2026
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