118-WW TMG MFG OPS
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Product Engineer

MalaysiaMalaysia·Malaccamid
EngineeringProduct Engineer
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Quick Summary

Key Responsibilities

Development work in support of a broad range of analog amplifiers, temperature sensors,

Technical Tools
EngineeringProduct Engineer

Responsibilities

~1 min read
  • Development work in support of a broad range of analog amplifiers, temperature sensors, sensor based analog front ends and application specific signal processing comprising of advanced Integrated Circuits that address Automotive and Industrial markets
  • Collaborate and work in a team environment with Design, Applications, Test, Marketing, Manufacturing, Quality and Reliability in all aspects of new product development, production release to accomplish goals and objectives
  • Design bench evaluation PCBs (printed circuit boards) and generating characterizations programs for bench evaluations
  • Perform evaluation, debug and characterization of integrated circuits to ensure they meet the product requirement specifications and manufacturing requirements
  • Work with failure analysis (FA) to determine root cause of any reliability and qualification failures
  • Work with process and package technology development to develop and qualify technologies for new product development
  • Work closely with the global manufacturing facilities to address customer specific product quality, yield management and cost reductions issues on mature products. Scope of work could include product spins and derivatives

Requirements

~1 min read
  • Bachelor's degree in Electrical Engineering, Computer Engineering, Electrical and Computer Engineering or related field
  • Cumulative 3.0/4.0 GPA or higher
  • Minimum 2 years of relevant experience in product engineering or semiconductor-related roles
  • Strong communication and collaboration skills – able to communicate clearly, work effectively with cross-functional teams, and build strong working relationships
  • Strong technical background in product engineering – solid technical knowledge relevant to the role, including understanding of semiconductor manufacturing flow, bench validation, characterization, and failure analysis
  • Project and execution mindset – able to manage multiple projects, maintain schedules, take initiative, and deliver results in a fast-paced environment
  • Automation and data analysis skills – programming capability for bench automation and strong knowledge of statistics and data analysis to support characterization, test limit setting, and yield understanding
  • Hands-on lab and debug experience – experienced in using lab equipment for data collection, device debug, and testing of analog, mixed-signal, and digital circuits

Location & Eligibility

Where is the job
Malacca, Malaysia
On-site at the office
Who can apply
MY

Listing Details

Posted
July 29, 2026
First seen
July 29, 2026
Last seen
July 29, 2026

Posting Health

Days active
0
Repost count
1
Trust Level
44%
Scored at
July 29, 2026

Signal breakdown

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118-WW TMG MFG OPSProduct Engineer