14d ago

Wirebond & Die Attach Process Engineer (MES Project)

Malaysia·Kuala Lumpurmid

EngineeringProcess Engineer

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Quick Summary

Key Responsibilities

MES Implementation (Project Phase): Drive manufacturing process design within the MES. Define process flows, routing, material handling, and traceability.

Requirements Summary

Transition to a production role to manage process stability, use MES data for yield enhancement, and optimize process parameters (e.g., wedge bonding optimization) through the new digital framework.

Technical Tools

EngineeringProcess Engineer

Responsibilities

~1 min read

→Bachelor's degree in Chemical Engineering, Chemistry, Electrical Engineering, Materials Science Engineering, Mechanical Engineering, Physics, or a related field
→Strong hands-on semiconductor process experience in Wire Bond and/or Die Attach, with minimum 2 years of relevant experience
→Strong foundation in statistical process control, engineering change control and process release strategies

Requirements

~1 min read

Working knowledge of MES, quality systems, or manufacturing execution platforms.
Experience in optimizing process parameters for wedge bonding or die attach accuracy.
Demonstrated strong analytical and problem solving skills
Strong verbal and written communication skills
Ability to work in teams and collaborate effectively with people in different functions
Strong time management skills that enable on-time project delivery
Demonstrated ability to build strong, influential relationships
Ability to work effectively in a fast-paced and rapidly changing environment
Ability to take the initiative and drive for result