Principal PCB Design Engineer

Echodyne offers the world’s first compact solid-state true beam-steering radar for a wide range of industries and applications. Our high-performance radars work in all weather and are designed for autonomous vehicles, uncrewed aircraft & drones, and security of borders, critical infrastructure, and smart cities. The company combines the patented technology of metamaterials with powerful software to create a radar sensor with unprecedented performance at commercial price points. Echodyne offers its radars to companies working in Automotive, Transportation, Critical Infrastructure Protection, Border Security, Smart Cities, Uncrewed Aircraft Systems (UAS), and Airspace Management including Urban Air Mobility (UTM).

Echodyne is seeking a Principal PCB Design Engineer to join the Advanced Technology Development team and lead physical design for demanding RF, high-speed digital, mixed-signal, and power electronics used in rapid radar prototypes and future products.

You will join a high-performing, cross-disciplinary team where senior engineers have meaningful technical ownership, run fast experiments, and see their work move directly into future radar products. You will work on prototype development, including tiled-aperture electronics, distributed beam control, modular RF and compute hardware, and fast calibration and test infrastructure.

The ideal candidate combines deep PCB design expertise with sound technical judgment, close supplier engagement, and the ability to balance electrical performance with reliable, repeatable manufacturing.

• →Lead PCB physical design for advanced technology prototypes, advanced test vehicles, and future high-performance radar platforms
• →Translate RF, antenna, analog, high-speed digital, power, mechanical, and manufacturing requirements into practical stackups, constraints, placement, routing, and interconnect solutions
• →Create prototype boards, coupons, and test vehicles that prove new materials, structures, fabrication methods, and assembly approaches
• →Collaborate with RF, electrical, mechanical, systems, manufacturing, suppliers, and key stakeholders to deliver mission-critical hardware within demanding engineering constraints
• →Apply modern best-practices and establish reusable guidance for design for manufacturing (DFM), design for assembly (DFA), design for test (DFT), reliability, stackups, and known layout limits
• →Provide Principal-level leadership through design reviews, supplier collaboration, mentoring, hands-on prototype bring-up, and transition of proven PCB solutions into product development

• Strong hands-on experience designing complex multilayer PCBs for RF, high-speed digital, mixed-signal, analog, or power applications
• Advanced proficiency with Altium Designer or an equivalent PCB design platform, including constraint management, library use, fabrication outputs, and design review
• Strong knowledge of stackups, controlled impedance, return paths, via structures, interconnects, laminates, finishes, tolerances, and PCB fabrication processes
• Practical command of signal integrity, power integrity, EMI and EMC, thermal behavior, reliability, design for manufacturing, design for assembly, and design for test
• Experience translating schematics, performance budgets, and interface requirements into manufacturable placement and routing decisions
• Experience working directly with PCB fabricators, assembly suppliers, materials and process engineers, and prototype build teams
• Ability to communicate design decisions, constraints, and risks clearly

• Experience developing PCB technologies for radar, phased arrays, aerospace, defense, sensing, or other high-reliability and mission-critical products
• Experience in advanced technology development, applied research, rapid prototyping, or early hardware technology maturation
• Experience with antenna or RF-aperture PCB implementation, HDI, high-layer-count boards, rigid-flex, flex circuits, PTFE, mixed-material stackups, or metal-backed boards
• Experience laying out high-speed data converters, clock and frequency-synthesizer circuits, downconversion chains, FPGA or SoC interfaces, or high-current power distribution
• Competence with analysis tools such as Ansys Electronics Desktop, SIwave, High Frequency Structure Simulator (HFSS), HyperLynx, Sigrity, or equivalent signal, power, and electromagnetic analysis tools
• Experience with supplier capability studies, qualification builds, design of experiments, yield analysis, failure analysis, or corrective action
• IPC CID, CID+, or another relevant PCB design certification

• BS in Electronics, Electrical Engineering Technology, or a related technical field and at least 12 years of relevant PCB design experience, or equivalent experience
• Eligibility to handle export-controlled technical data, including ITAR- and EAR-controlled information