Senior Hardware Engineer: Connectivity Modules

At General Motors, our product teams are redefining mobility. Through a human-centered design process, we create vehicles and experiences that are designed not just to be seen, but to be felt. We’re turning today’s impossible into tomorrow’s standard —from breakthrough hardware and battery systems to intuitive design, intelligent software, and next-generation safety and entertainment features. 

Every day, our products move millions of people as we aim to make driving safer, smarter, and more connected, shaping the future of transportation on a global scale.

Connectivity is a critical enabler of advanced vehicle functionality, including safety, user experience, and cloud-connected services. We are seeking a Senior Hardware Engineer to lead the design and system integration of next-generation automotive connectivity platforms across GM vehicle architectures.

• The ideal candidate has strong experience in hardware architecture, system bring-up, and cross-functional integration of complex embedded systems combining high-performance compute and wireless connectivity.

• They are comfortable operating across hardware, firmware, and RF domains to drive system-level decisions and resolve complex issues.

• The Senior Hardware Engineer will lead the design, architecture, and system integration of connectivity modules across GM vehicle platforms. This includes defining system architecture, driving schematic and PCB design execution, leading board bring-up, and ensuring robust system performance across all operating conditions.

• This role requires end-to-end ownership, from concept through production, with strong collaboration across silicon vendors, RF, firmware, mechanical and thermal.

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  Own end-to-end hardware design and bring-up of connectivity modules from concept through production.

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  Define system architecture, including SoC selection, memory (LPDDR), power architecture, and high-speed interfaces (PCIe, USB, Ethernet).

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  Drive schematic design reviews and guide PCB layout, ensuring strong SI/PI, RF coexistence, and manufacturability.

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  Lead board bring-up, including power sequencing, clocking, reset, and boot initialization.

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  Drive system-level integration across hardware, firmware, RF, and mechanical domains.

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  Perform root-cause analysis of complex, cross-domain issues, including interactions between silicon, board design, RF, and software.

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  Make system-level tradeoffs across performance, power, cost, thermals, and reliability.

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  Validate high-speed interfaces including LPDDR5, PCIe, USB, Ethernet, SPI/I2C, CAN, and LIN.

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  Debug multi-domain issues such as RF desense, power noise coupling, and signal integrity degradation.

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  Collaborate with silicon vendors (e.g., Qualcomm, NXP, TI) on SoC bring-up and interface behavior.

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  Collaborate with firmware and software teams to enable platform functionality and debug system issues.

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  Define validation strategy and coverage, ensuring system-level robustness across corner cases and operating conditions.

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  Leverage lab instrumentation (oscilloscopes, VNAs, spectrum analyzers, logic analyzers) to characterize and debug system performance.

• Bachelor’s degree in Electrical Engineering, Computer Engineering, Computer Science or related field.

• 5+ years of experience in hardware development, including board design, system bring-up, and debugging.

• Strong experience designing and integrating complex embedded hardware systems.

• Experience with SoC-based systems, including power architecture, clocks, resets, and boot flows.

• Experience with high-speed digital design (PCIe, USB, Ethernet, LPDDR) including signal and power integrity considerations.

• Proven ability to debug system-level issues across hardware, firmware, and RF domains.

• Experience with power delivery design, PMICs, Voltage regulators, low-power design principles, and deep sleep/wake-up flows.

• Strong problem-solving skills with ability to navigate complex, ambiguous system issues.

• Ability to independently drive technical decisions and influence cross-functional teams.

• Master’s degree in related engineering field.

• 8+ years of experience in hardware development, including board design, system bring-up, and debugging.

• Knowledge and experience in wireless interfaces and technology.

• Experience with automotive hardware development (EMI/EMC, environmental, reliability).

• Experience supporting products through production ramp and field issue resolution.

General Motors is committed to being a workplace that is not only free of unlawful discrimination, but one that genuinely fosters inclusion and belonging. We strongly believe that providing an inclusive workplace creates an environment in which our employees can thrive and develop better products for our customers.

All employment decisions are made on a non-discriminatory basis without regard to sex, race, color, national origin, citizenship status, religion, age, disability, pregnancy or maternity status, sexual orientation, gender identity, status as a veteran or protected veteran, or any other similarly protected status in accordance with federal, state and local laws. 

We encourage interested candidates to review the key responsibilities and qualifications for each role and apply for any positions that match their skills and capabilities. Applicants in the recruitment process may be required, where applicable, to successfully complete a role-related assessment(s) and/or a pre-employment screening prior to beginning employment. To learn more, visit How we Hire.

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