Principal Wafer Process Engineer

• Typically requires a degree in Science, Technology, Engineering, or Mathematics (STEM) and a minimum of 8 years of prior relevant experience.
• Experience in Semiconductor Engineering, Manufacturing Engineering, and/or Process Engineering in Optics, Electro-Optics or Microelectronics environment or Wafer Processing.

• Experience with wet etch, metal-lift off, lithography, plasma cleaning, and associated semiconductor process equipment
• Experience with principles of vacuum system operations
• Experience with principles of photolithography
• Experience with etch (dry and wet)
• Experience with infrared detector technology and semiconductor physics
• Project management experience
• Knowledge of statistical process control and design of experiments
• Equipment and controls system experience

At Raytheon, the foundation of everything we do is rooted in our values and a higher calling – to help our nation and allies defend freedoms and deter aggression. We bring the strength of more than 100 years of experience and renowned engineering expertise to meet the needs of today’s mission and stay ahead of tomorrow’s threat. Our team solves tough, meaningful problems that create a safer, more secure world. 

Raytheon Vision Systems (RVS) is a world leader in the research, design and manufacturing of focal plane arrays and flight-based vision systems. Our Focal Plane Operations Process Engineering department provides world class semiconductor and focal plane array manufacturing processes in support of production and development products. We have an opportunity for a talented Principal Process Engineer with a background in semiconductor manufacturing or thin film deposition.

The Focal Plane Process Engineering department at RVS supports semiconductor wafer fabrication of challenging Electro-Optical applications in the Space, Tactical, Airborne and Emerging markets. The candidate will work with and lead other process engineers, skilled technicians, and cross-functional teams to develop strategies and processes for improving the fab performance and output using our metrics.

The ideal candidate will have technical proficiency in various fabrications of semiconductor components or microelectronics using lithography, deposition, furnace, dry etch, wet etch, and metrology as well as proficiency and comfort in interfacing with multiple functions including Product Engineering, Systems Engineering, Quality, Mechanical Design Engineering, Factory Management, Equipment Engineering and Process Engineering.

• Managing process development and improvement projects, including novel processing techniques, yield increase, throughput, and safety improvements
• Responsible for reviewing material in WIP, certifying operators, dispositioning out of flow material, and hands on processing of novel detector designs
• Providing Process Ownership of vacuum coating tools, etch tools, or lithography tools
• Developing requirements and qualification plans for new equipment procurements.
• Work in a cleanroom environment with full cover all garments.

• Please consider the following role type definition as you apply for this role.

• Onsite: Employees who are working in Onsite roles will work primarily onsite. This includes all production and maintenance employees, as they are essential to the development of our products.

This position is an onsite role – Goleta, CA:

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