Quality and Reliability Engineer (Advance Packaging & Assembly)

• →Apply Advanced Packaging expertise to assess inline process health, excursion impact, yield risk, defect mechanisms, and downstream packaging implications.
• →Collaborate with cross-functional teams to drive effective root cause analysis, systemic corrective and prevention actions using 8D and related problem-solving methodologies.
• →Partner with fab manufacturing, substrates assembly, test, process engineering, and quality teams to strengthen early excursion detection, process controls, in-line screens, and outgoing quality.
• →Drive quality control improvements devising incoming/ outgoing quality controls, using statistical process control, defect pareto analysis, control plans, audit learnings, and excursion prevention indicators across fab, substrate manufacturing, and assembly manufacturing steps.
• →Support manufacturing excursion management, including MRB facilitation, containment strategies, rapid product risk assessment, discrepant material disposition decisions, and clear communication with Foundry partners and Intel customers.
• →Provide technical input on thermomechanical interactions between wafer, die, and package to support risk assessment and technical decision-making.
• →Own and continuously improve material disposition RFCs, Rel monitors (QTM, ORM), and Quality and Reliability best known methods.
• →Support technology certification and transfer activities in collaboration with technology development and ramp partners.
• →Use data extraction and statistical analysis tools, and custom scripting to flag product, process, or customer risks.
• →Represent the Quality and Reliability function as the voice of the customer in internal forums, providing recommendations to improve system, process, product quality, and reliability outcomes.

Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

• Bachelor or Master's degree in Materials Science, Physics, Chemical Engineering, Mechanical Engineering, or a related field with relevant experience in semiconductor manufacturing (wafer-level assembly WLA, Die prep, packaging Substrates).
• at least 3 years of relevant work experience in semiconductor manufacturing (wafer-level assembly WLA, Die prep, packaging Substrates) with a bachelor's degree.
• Experience in quality and reliability methodologies, excursion management, and failure mode analysis.
• Proficiency in statistics and data analytics tools for quality and reliability assessments.
• Familiar with QnR Quality Systems and tools.
• Effective verbal and written communication, and effective meetings skills.
• Motivated self-starter and self-driven learner to develop skills in various semiconductor and assembly processes.
• Demonstrate strong Quality and Zero-defect mindset, and Intel values of Velocity, Efficiency, and Customer 1st.
• Be comfortable working in a diverse environment and across geographies.
• Travel might be required.

• Influencing skills to drive a quality-focused mindset across the organization.
• Proven ability to manage impactful quality events

Join us to help shape the future of manufacturing quality and reliability at Intel. In this role, you will make a lasting impact on product quality, process robustness, and customer experience while advancing next-generation semiconductor manufacturing technologies.

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