Quality and Reliability Engineer

• →Manage manufacturing excursions while driving continuous improvement: chair MRB meetings, drive containment strategies, rapid product risk assessments and discrepant material dispositions (3D). Effectively communicate with internal Foundry partners and Intel customers.
• →Provide technical input on solder joint reliability and thermomechanical interactions between wafer, die, and package to support risk assessment and technical decision-making.
• →Collaborate with cross-functional teams to drive effective Root Cause and systemic Corrective actions (8D's).
• →Develop and implement systems for early detection and containment of excursions.
• →Own and continuously enhance material disposition RFC's, eDispo screens, and other QnR best known methods.
• →Support factory Operations and output commits, e.g. daily/ timely material disposition and die inking for meeting commits.
• →Support technology certification and ramp activities collaborating with TD and ramp partners.
• →Use data extraction tools, custom scripting and statistical analysis techniques to assess and present inline, EOL, and Reliability data.
• →Extract insights from structured and unstructured data using statistics and machine learning to determine product disposition.

• Master's degree in Material Science, Physics, Chemical Engineering, Mechanical Engineering or related field of study with relevant work experience in semiconductor Manufacturing, C4 bumping process and chip assembly.
• 5 years of relevant work experience in semiconductor Manufacturing, C4 bumping process, and chip assembly with a bachelor's degree.
• Experience in solder joint reliability, excursion management, and failure mode analysis.
• Proficiency in statistics and data analytics tools for quality and reliability assessments.
• Experience with data mining to synthesize insights from structured and unstructured data.
• Familiar with QnR Quality Systems and tools.
• Effective verbal and written communication, and effective meetings skills.
• Motivated self-starter and self-driven learner to develop skills in various semiconductor and chip assembly processes.
• Demonstrate strong Quality and Zero-defect mindset, and Intel values of Velocity, Efficiency, and Customer 1st.
• Be comfortable working in a diverse environment and across geographies.

• Influencing skills to drive a quality-focused mindset across the organization.
• Proven ability to manage impactful Material Review Boards (MRBs).

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