Semiconductor Packaging Process Engineering Lead

Intel Corporation is a global leader in the semiconductor industry, engineering the foundational technologies that power modern computing. Within Intel, the Epoxy Mold Module division plays a pivotal role in developing and scaling world-class semiconductor packaging solutions. By advancing next-generation assembly processes and driving operational excellence, our group directly enables Intel’s product roadmap and delivers innovative, high-quality products to customers worldwide.

We are seeking a visionary and action-oriented Packaging Module Development Manager to lead our engineering team in Arizona. In this critical leadership role, you will guide a specialized team responsible for advancing semiconductor packaging processes and introducing new equipment within a 24x7 manufacturing environment. Your strategic oversight and mentorship will directly resolve complex technical challenges, elevate manufacturing yield and throughput, and shape the future of Intel's packaging capabilities.

• →Team Leadership & Mentorship: Lead, mentor, and develop a team of engineers across a 24x7 operation, cultivating technical expertise, clear goal alignment, and differentiated execution.
• →Process & Equipment Introduction: Guide the deployment, implementation, and optimization of new packaging equipment and process technologies into the manufacturing environment.
• →Specification Oversight: Direct equipment and process specifications to guarantee strict alignment with operational goals and manufacturing expectations.
• →Cross-Functional Partnership: Manage shift engineering coverage and build strong partnerships across manufacturing, automation, and partner engineering groups.
• →Strategic Roadmap Execution: Formulate long-term strategies that advance manufacturing efficiency, yield, throughput, and overall process manufacturability while championing a quality-first culture.

• Inspirational Leadership: Proven talent for coaching, mentoring, and empowering engineering teams to achieve high-impact results and career growth.
• Results-Driven Accountability: Strong commitment to clear goal setting, structured performance management, and operational excellence.
• Strategic Problem Solver: Decisive, analytical mindset suited for navigating complex operational challenges and influencing long-term roadmaps.
• Collaborative Influencer: Exceptional communication and interpersonal skills to build consensus and drive alignment across diverse, cross-functional stakeholders.
• Quality-First Mindset: Dedication to high standards, continuous improvement, and proactive risk mitigation in a fast-paced environment.

Are you ready to lead a high-performing engineering team and shape the future of semiconductor packaging technology? Apply today to join Intel's Epoxy Mold Module leadership team in Chandler, Arizona!

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Relevant experience can be obtained through schoolwork, classes and project work, internships, military training, and/or work experience.

• Bachelor’s Degree in Materials Science, Mechanical Engineering, Electrical Engineering, Chemical Engineering, Physics, or a related STEM field AND 6+ years of professional experience in engineering or manufacturing, relevant experience OR
• Master’s Degree in the above fields AND 4+ years of professional experience, relevant experience OR
• PhD in the above fields AND 2+ years of relevant experience.
• Relevant experience will be any of the following:
  • Developing, qualification testing, or releasing semiconductor packaging assembly processes
  • Equipment or prior professional ownership of DOE (Design of Experiments), SPC (Statistical Process Control), or JMP/Minitab data modeling to resolve process anomalies or optimize yields.

• 4+ years of experience in:
  • Semiconductor Assembly Process Technology Development (TD), leading processes from pathfinding through to high-volume manufacturing (HVM) transfer.
  • Direct people management or formal team leadership experience, including direct ownership of performance reviews, engineering career development plans, and team resource allocation.
  • Specialized Hardware Expertise: Documented experience working directly with, configuring, or troubleshooting one or more of the following equipment types: automated fluid dispense systems, thermal curing/bonding ovens, plasma treatment chambers, or optical/acoustic metrology tools.
  • Roadmap Influence & Problem Solving: A documented history of initiating, driving, or influencing equipment development roadmaps or technical supplier specifications that resulted in measurable improvements in cost, quality, or tool throughput.
  • Operational Results: Examples of leading cross-functional projects (partnering with Automation, Yield, or Quality teams) that resulted in documented gains in yield, reduction in defect rates, or optimization of line throughput.

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