Assembly and Packaging Process Engineer

• Lyte builds perception systems for Physical AI operating in complex environments. The company combines custom silicon, integrated sensors, and software into a unified platform for robotics, mobility, and next-generation automation. Lyte is headquartered in Sunnyvale, California, with a global presence. For more information, visit www.lyte.ai

• We are seeking an entry or middle level assembly and packaging Engineer with degree in Electrical Engineering, Photonics, Mechanical Engineer, or a related field.  

• →Work with our OSAT in Asia to support company device packaging process improvements for NPI and volume manufacture  
• →Work with our CMs (contract manufactures) in Asia to support our optical engine and subcomponent assembly and process improvement for NPI and volume manufacture   
• →Project tracking weekly. 
• →Write technical reports and present results. 
• →Analyze data and track OSATs, Assembly houses, contract manufacturers Cp and Cpk for internal use. 
• →Support tests and reliability work at component level CoC, device level, optical engine, and module system assembly. 
• →Maintain the software and firmware support for testing and relevant setups.  

• Minimal requirement is a bachelor's degree with 1 years of experience.  
• The successful candidate need have English communication capability.  
• Experience or knowledge of PCB assembly with SMT line  
• Hands-on experience in laboratory experimentation and data analysis 
• English communication capability is a must. 
• Familiar with Microsoft Office. 
• Fast learner is a must. 
• Good work ethics and Maintain company confidential information are a must   

• Higher degree with more experience is highly desired. 
• Experience with microelectronic device packaging. 
• Former experience of optical device packaging is highly desirable. 
• Experience with hands-on testing of photonic and electronic. device/components. 
• Device test knowledge and experience for at least some following areas for: IIIV CoC, wafer level probe test, packaged electro-optical devices, assembly modules, PCBA.    
• Knowledge and experience in at least some following processes: IIIV or CMOS wafer level process; IIIV bar level processes; device packaging processes such as die attach, flip chip, wire bonding, and module mechanical assembly processes, particularly camera and lidar module assembly.   
• Experience in SolidWorks and familiar with Engineering drawing is a plus. 
• Data analysis experience such as JMPs is a plus; excel is OK. 
• Programming and software maintenance skills are desired eg. python, or C++ 
• Understanding the microelectronic reliability tests and mechanical reliability tests are desirable.  
• Experience in microsystem assembly such as hard disk assembly is a plus. 

Benefits (subject to location and local regulations)

• Competitive salary and equity 
• Comprehensive medical, dental, and vision coverage 
• 401(k) retirement plan 
• Flexible vacation and time-off policy 
• Collaborative, fast-paced, and inclusive work environment 
• Opportunity to work on cutting-edge technologies with a highly cross-functional team