Senior Design Engineer, HBM

United States·Richardsonsenior

EngineeringDesign Engineer

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Quick Summary

Key Responsibilities

Design, optimize, and valSupport post‑silicon bring‑up, failure analysis, and design correlation when required Work closely with layout engineers on floorplanning, placement, routing,

Requirements Summary

Prior experience in HBM, DRAM, high‑speed I/O, or memory‑related designs Familiarity wiconstraints Apply AI/ML- nabled tools that enhance productivity, design quality, verification coverage,

Technical Tools

EngineeringDesign Engineer

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

As a Sr Design Engineer, you will work on design, simulation, and validation of next‑generation High‑Bandwidth Memory (HBM) architectures and circuit blocks. HBM requires advanced DRAM design knowledge combined with deep understanding of 3D stacked architecture, TSV signaling, wide I/O interfaces, PHY timing, power integrity, and system co‑optimization with GPUs/accelerators.
This role sits at the intersection of DRAM design and high‑performance computing, enabling future AI/ML, HPC, and advanced graphics products.

In this position, you will collaborate with Micron’s various design and verification teams all over the world and support the efforts of groups such as Product Engineering, Test, Probe, Process Integration, Assembly and Marketing to proactively design products that optimize all manufacturing functions and assure the best cost, quality, reliability, time-to-market, and customer satisfaction.

Responsibilities

~1 min read

For US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s People Organization at hrsupport_na@micron.com or 1-800-336-8918 (select option #3)

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