Advanced Package Design Engineer

At SK hynix America, we are at the forefront of semiconductor innovation. As a global leader in HBM, DRAM, and NAND flash technologies, we develop the advanced memory solutions powering everything from advanced mobile technology to massive AI data centers. With major investments in the U.S. and a leading position in the global AI revolution, we build the critical infrastructure of the digital landscape and remain committed to sustainable operations. We invite innovative minds to be part of our journey. Here, you will be part of a collaborative team pioneering the next generation of memory technologies, expanding our market footprint, and defining the future of computing.

We are seeking a skilled Advanced Package Design Engineer to join our Packaging Engineering team in SK Hynix America. You will be responsible for designing and optimizing high-performance, high-density Interposers for chiplet-based architectures and heterogeneous integration solutions. You’ll collaborate closely with PCB, SI/PI, thermal, and manufacturing teams to deliver robust, manufacturable, and cost-effective package solutions

• →Design silicon and organic interposers for advanced packaging solutions
• →Experience in EDA tools such as Virtuoso/APD, Synopsys Custom Compiler, Siemens Xpedition to create and verify advanced package layouts
• →Perform design studies and what if scenario analysis for advanced packaging schemes to optimize the overall package design.
• →Create and maintain layout design rules, stack-ups, and layout guidelines
• →Collaborate with internal and external stakeholders to ensure seamless advanced packaging technology development

• Bachelor’s or Master’s degree in Electrical Engineering (Preferred), Mechanical Engineering, Material Science, or a related field.
• 3+ years of experience in semiconductor package design or layout
• Proven experience with layout tools Virtuoso/APD, Synopsys Custom Compiler, Siemens Xpedition
• Understanding of high-speed signal routing, power distribution networks (PDN)
• Familiar with 2.5D/3D packaging technologies, substrate design rules, and large body substrate technologies
• Effective communication skills and ability to work in a fast-paced, cross-functional environment

• Currently pursuing a PhD's degree in Electrical Engineering or a related field
• 5+ years of experiences in advanced packaging layout design
• Experience with SI/PI simulation tools (Ansys, HFSS, ADS)
• Proven understanding of high-speed signal routing, power distribution networks (PDN)
• Proven technical understanding of advanced packaging materials, their interactions, failure mechanisms and analytical techniques

SK hynix America is an Equal Employment Opportunity Employer. We provide equal employment opportunities to all qualified applicants and employees and prohibit discrimination and harassment of any type without regard to race, sex, pregnancy, sexual orientation, religion, age, gender identity, national origin, color, protected veteran or disability status, genetic information, or any other status protected under federal, state, or local applicable laws.

In compliance with federal law, SK hynix America also participates in the federal E-Verify program. Upon accepting an offer of employment, all newly hired individuals will be required to complete Form I-9, which includes verifying identity and legal authorization to work in the United States. Please review the official government posters detailing your rights and protections prior to applying:

• E-Verify Participation Poster (Bilingual English & Spanish)
• IER Right to Work Poster (English)
• IER Right to Work Poster (Spanish)