Substrate Process Engineer

United States·Goletafull-timemid

EngineeringProcess Engineer

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Quick Summary

Key Responsibilities

Develop and maintain wafer bonding processes (eutectic, thermocompression, direct, adhesive). Wet etch processes (Si, oxide, metals) including rate and uniformity control.

Requirements Summary

B.S. or M.S. in Engineering (Materials, Chemical, Electrical, Mechanical,

Technical Tools

EngineeringProcess Engineer

About Atomica:

Atomica is a U.S.-based MEMS and microfabrication foundry. We partner with customers to develop and manufacture leading-edge technologies for applications in medical devices, aerospace, photonics, artificial intelligence (AI), and sensing and other advanced industries.

We bring together multidisciplinary teams of engineers and manufacturing experts to transform complex concepts into commercially-viable products that enable the next generation of innovation.

About the Position:

We are seeking a highly skilled and motivated Substrate Process Engineer with expertise in wafer bonding and high-precision alignment to join our MEMS fabrication team. This role focuses on developing and sustaining critical wafer-level bonding and alignment processes, such as anodic, fusion, direct, and adhesive bonding, with a strong emphasis on sub-micron to micron-level alignment accuracy required for MEMS device integration. The candidate will work closely with process engineering, integration, and R&D teams to enable reliable and scalable backend processes in a cleanroom manufacturing environment.

Key Responsibilities:

Develop and maintain wafer bonding processes (eutectic, thermocompression, direct, adhesive).
Wet etch processes (Si, oxide, metals) including rate and uniformity control.
Support electroplating processes (Au, Cu, Ni, NiFe, AuSn).
Support Dicing, CMP , wafer Grinding processes.
Improve yield, reduce defects, and optimize process stability.
Perform DOE, root cause analysis, and SPC monitoring.
Support equipment qualification and uptime.
Work closely with R&D, production, and quality teams.

Qualifications:

B.S. or M.S. in Engineering (Materials, Chemical, Electrical, Mechanical, or related)
3+ years experience in semiconductor or MEMS fabrication
Hands-on experience in at least two of the following:
- Wafer bonding
- Wet etching
- Electroplating
- CMP or wafer thinning
- Dicing

Why work with us?

Atomica is changing the world. Working at Atomica is truly a one-of-a-kind opportunity to impact groundbreaking technology while living in paradise.

Your contributions to our MEMS technology will drive innovation, solve the great problems of our time and directly impact the lives of people across the globe.

Life in Santa Barbara:

Want to live in paradise? Life in Santa Barbara is just that. Atomica is sandwiched between the beautiful Santa Ynez mountains and the pristine Central California coastline. The weather? Absolutely gorgeous. No more shoveling snow or hiding from tornadoes!

Within 5-minutes from the office, you will find rich local culture, world class schools, airport for convenient travel, festivals, and excellent options to wine and dine.

We have had employees move from all over the country and say life has never been better!

Compensation:

$90,000-$140,000

*Atomica encourages applications from candidates at all levels where pay will be based on experience.*

Location & Eligibility

Where is the job

Goleta, United States

On-site at the office

Who can apply

About this job

Pay per year: $90,000–$140,000 a year; 5% above the $110,000 median for Process Engineer jobs on Jobera (303 salaries).
Who can apply: United States
Posted: 486 days ago
Employer: has 14 open jobs on Jobera.