~42m ago
New

Principal Applications Engineer

2 Locationslead
EngineeringApplication Engineer
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Quick Summary

Key Responsibilities

Collaborate with IC design, systems, FW, and test teams to translate field issues and customer

Requirements Summary

reference designs, lay

Technical Tools
EngineeringApplication Engineer

NXP’s SerDes Networking Solution (SNS) team delivers open-standard Automotive SerDes Alliance (ASA) Motion Link multi-Gigabit connectivity for next-generation sensors and vehicle displays. As part of the Applications Engineering team, you will work with both internal engineering teams to develop collaterals to ease customer adoption of our SerDes solutions, as well as with NXP’s field teams and customer engineering teams to ensure successful system design and bring-up.

Responsibilities

~1 min read
  • →Collaborate with IC design, systems, FW, and test teams to translate field issues and customer requirements into product improvements and new features.
  • →Review customer schematics and layouts for signal‑integrity and power‑integrity best practices (impedance control, terminations, return paths, via design, reference plane strategy).
  • →Lead board‑level bring‑up and validation using oscilloscopes, protocol analyzers; generate test reports and recommendations.
  • →Provide on‑site or remote debug support for complex customer issues.
  • →Develop and maintain application collateral: reference designs, layout guidelines, design checklists, characterization reports, application notes, training materials.
  • →Participate in trade shows and provide FAE training

Requirements

~2 min read
  • Bachelor’s degree or above in Electrical/Electronic Engineering or related field.
  • Extensive experience (12+ years) in hardware design, applications engineering, or system validation.
  • Familiarity with high-speed data communication protocols and interfaces, including Ethernet networking and switching, MIPI CSI-2, and display protocols (DP/eDP)
  • Strong understanding of high‑speed SerDes fundamentals: channel loss, reflections, return loss, insertion loss, ISI, jitter, equalization, and clocking.
  • Demonstrated experience with multi‑Gbps serial links (e.g., Ethernet, PCIe, DP, USB3.x/USB4, proprietary SerDes).
  • Proficiency with SI/PI tools and simulations (e.g., S‑parameter analysis, eye/jitter simulations) and comfort interpreting simulation and measurement correlation.
  • Hands‑on experience using lab equipment: high‑bandwidth oscilloscopes, TDR, VNA, BERT, protocol analyzers, logic analyzers, and related tools.
  • Strong skills in PCB design for high‑speed: layer stack‑up, routing constraints, differential pairs, reference planes, decoupling, and power delivery.
  • Excellent communication and presentation skills to explain complex technical topics to both expert and non‑expert audiences. ⁽⁵⁾
  • Ability to work effectively with global, cross‑functional teams (design, systems, test, marketing, field).

More information about NXP in the United States...

NXP is an Equal Opportunity/Affirmative Action Employer regardless of age, color, national origin, race, religion, creed, gender, sex, sexual orientation, gender identity and/or expression, marital status, status as a disabled veteran and/or veteran of the Vietnam Era or any other characteristic protected by federal, state or local law. In addition, NXP will provide reasonable accommodations for otherwise qualified disabled individuals.

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Location & Eligibility

Where is the job
Not specified
Location terms not specified
Who can apply
Same as job location

About this job

Posted
Today
Employer
has 797 open jobs on Jobera in 11 countries.

Listing Details

First seen
October 18, 2026
Last seen
October 18, 2026

Posting Health

Days active
0
Repost count
0
Trust Level
49%
Scored at
October 18, 2026

Signal breakdown

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Principal Applications Engineer