~16m ago
New

Die Attach Equipment Technician

MalaysiaMalaysia·Kuala Lumpurmid
OperationsMaintenance Technician
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Quick Summary

Requirements Summary

● Diploma in Electrical & Electronics or Mechanical and Engineering discipline,

Technical Tools
OperationsMaintenance Technician

Experience Die Attach Equipment Technician capable to work independently to maintain and repair Die Attach integrated line which include loader, unloader, die attach, AOI and reflow oven equipment. Die Attach Equipment Technician must have experience working in semiconductor assembly equipment, strong troubleshooting skill and equipment knowledge to ensure all equipment performance always in tip-top condition to meet department OEE and MTBA/MTBF goals.

Responsibilities:

● Die Attach Equipment Technician specialist and vast experience working on Die Attach equipment such as Datacon 8800 FC QUANTUM is a must and preferable also have experience on Hanwha Die Attach equipments.

● Maintain and repair Die Attach integrated line which include loader, unloader, die attach, AOI and reflow oven equipment.

● Perform equipment setup or conversion for any product changes for Die Attach integrated line which include loader, unloader, die attach, AOI and reflow oven equipment.

● To able to work independently to identify, sustain, purchase, find second source for Die Attach integrated critical spare and tooling.

● To maintain/sustain equipment performance to meet define goal.

● Improve FC Overall OEE, MTBA/MTBF, PM Effectiveness and Unscheduled Downtime.

● To maintain the machine performance, address the problem root cause and solve quality issue cause by the machine.

Compensation Details

● Support production to meet weekly schedule targets through working either normal or shift hours when or where needed. This especially true weekends and public holidays.

● Manage the maintenance activities of machines and fabrication of spare parts.

● Good discipline and tardiness with minimum supervise

Requirements:

● Diploma in Electrical & Electronics or Mechanical and Engineering discipline, or certificate with min 5 years’ of relevant working experience in Die Attach equipment

● Experience in semiconductor assembly and applied statistics will be an advantage

● Have good technical skills on Front and Back End assembly equipment

● Strong interpersonal and communication skills

● Good decision making / problem solving skills.

● Familiar with production environment & possesses process handling knowledge. (Semiconductor).

● Must be discipline and willing to work long hours and shifts.

● Must adhere NXP Total Quality Mindset and Safety Awareness.

● Must adhere NXP core value Trust and Respect, Collaboration, Ownership, Expertise, Innovation and Growth.

#LI-DNI

Location & Eligibility

Where is the job
Kuala Lumpur, Malaysia
On-site at the office
Who can apply
MY

About this job

Who can apply
Malaysia
Posted
Today
Employer
has 797 open jobs on Jobera in 11 countries.

Listing Details

First seen
October 18, 2026
Last seen
October 18, 2026

Posting Health

Days active
0
Repost count
0
Trust Level
51%
Scored at
October 18, 2026

Signal breakdown

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Die Attach Equipment Technician